VO2 Substrate Effect on the Thermal Rectification of a Far-Field Radiative Diode

I.Y. Forero-Sandoval, J.A. Chan-Espinoza, J. Ordonez-Miranda, J.J. Alvarado-Gil, F. Dumas-Bouchiat, C. Champeaux, K. Joulain, Y. Ezzahri, J. Drevillon, C.L. Gomez-Heredia, and J.A. Ramirez-Rincon
Phys. Rev. Applied 14, 034023 – Published 9 September 2020
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Abstract

Thermal rectification of far-field heat currents is experimentally demonstrated by exploiting the metal-insulator transition of VO2 driving the significant temperature variations of its emissivity, within a narrow interval of temperatures. This is achieved by measuring remarkable differences on the radiative heat flux between a VO2 film placed in vacuum and in front of a heat fluxmeter, when their temperature difference is reversed. By testing three VO2 films deposited on a substrate of r-sapphire, c-sapphire, and silicon, the highest rectification factor of 61% is obtained for the first film operating with a temperature difference of 40C with respect to the fluxmeter. This rectification factor is higher than or comparable to the respective ones reported in the literature for near- or far-field radiative diodes subjected to a temperature difference of 70C between their terminals. This experimental value is consistent with the theoretical one predicted by an analytical expression derived for the maximum rectification factor, as a function of the VO2 emissivity in the metallic and insulating phases, sensor emissivity, and geometrical parameters. The obtained results thus show that the rectification factor of these diodes can be enhanced, while reducing the temperature difference of their terminals, by increasing not only the emissivity variations between the insulating and metallic phases of VO2 films deposited on r-sapphire, but also decreasing their emissivity in the metallic phase.

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  • Received 11 June 2020
  • Revised 5 August 2020
  • Accepted 10 August 2020

DOI:https://doi.org/10.1103/PhysRevApplied.14.034023

© 2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

I.Y. Forero-Sandoval1,2,*, J.A. Chan-Espinoza2, J. Ordonez-Miranda1,†, J.J. Alvarado-Gil2, F. Dumas-Bouchiat3,‡, C. Champeaux3, K. Joulain1, Y. Ezzahri1, J. Drevillon1, C.L. Gomez-Heredia2, and J.A. Ramirez-Rincon2

  • 1Institut Pprime, CNRS, Université de Poitiers, ISAE-ENSMA, Futuroscope Chasseneuil F-86962, France
  • 2Applied Physics Department, CINVESTAV-IPN Mérida, Mérida, Yucatán C.P. 97310, México
  • 3Université de Limoges, CNRS, IRCER, UMR 7315, Limoges F-87000, France

  • *iyforeos@gmail.com
  • jose.ordonez@cnrs.pprime.fr
  • frederic.dumas-bouchiat@unilim.fr

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Issue

Vol. 14, Iss. 3 — September 2020

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