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Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results

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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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References

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Author information

Authors and Affiliations

  1. University of California, USA

    E. Suhir

  2. University of Maryland, USA

    E. Suhir

  3. ERS/Siloptix Co., Los Altos, CA, 94024, USA

    E. Suhir

Authors
  1. E. Suhir
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Editor information

Editors and Affiliations

  1. University of California, Santa Cruz, California, USA

    E. Suhir

  2. University of Maryland, College Park, Maryland, USA

    E. Suhir

  3. University of Colorado, Boulder, Colorado, USA

    Y. C. Lee

  4. Georgia Tech, Atlanta, Georgia, USA

    C. P. Wong

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Suhir, E. (2007). Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_21

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