Abstract
Modelling of ICs is mostly “just” restricted to the functional behavior of the design. Extending the modelling requirements into the EMC domain, including signal and power integrity and incorporating the application with the measurement environment requires a different approach. Fortunately, the IC in its package has only a limited number of pins/balls to the PCB connected thereto. A new approach is given which is presently under discussion and development in international standardization (IEC62433-x) by IEC SC47A/WG2, but also by other bodies like: EIA,IEEE [10, 12, 15] and/or proprietly organizations.
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References
R. Mavaddat, Network Scattering Parameters, World Science, 1996.
IBIS Modelling Cookbook For IBIS Version 4.0, Government Electronics and Information Technology Association and The IBIS Open Forum, 2005.
Models of integrated circuits for EMI behavioral simulation ICEM, IEC 62014–3.
Linear Equivalent Circuit and Current Source for I/O (LECCS-I/O) Modeling of IC Power Current for EMI Simulation, http://www.sdl. hitachi.co.jp/english/summary/2004/520161/ or 510028/
Models of integrated circuits for EMI behavioral simulation IMIC, IEC 62404.
Measurement of Electromagnetic Emission up to 1 GHz, IEC 61967-x
Measurement of Electromagnetic Immunity up to 1 GHz, IEC 62132-x
Measurement of Impulse Immunity, IEC 62215-x
IEC CISPR-xx, (see www.iec.ch)
Advanced Library Format, IEEE 1603, 2003.
Touchstone File Format Specification, Rev 1.1, EIA/IBIS open Forum, 2003.
A.L. Drozd, Selected Methods for Validating Computational Electromagnetic Modelling Techniques, IEEE, 2005.
Z.Y. Yang, S. Huq, V. Arumugham, I. Park, Enhancement of IBIS Modelling Capability in Simultaneous Switching Noise (SSN) and Other Power Integrity Related Simulations- Proposal, Implementation and Validation, IEEE 2005.
R. Kaw, I. Novak, M. Swaminathan, Towards Developing a Standard Input/Output Format for PDN Modelling and Simulation Tools, IEEE 2005.
M. Coenen, R. de Jager, Standardization for EMC IC Modelling, EMC COMPO 2005.
M. Coenen, D. de Greef, Optimization techniques for minimizing IR drop and supply bounce, EMC COMPO 2005.
E. Engin, Modeling of Lossy Interconnects and Packages with Non-Ideal Power/Ground Planes, PhD Thesis, University of Hannover, 2004.
MEDEA+ Mesdie, project A509, www.medeaplus.org
MEDEA+ Parachute, project 2A701, www.medeaplus.org
Electromagnetic Compatibility of Integrated Circuits; http://www. springer.com/sgw/cda/frontpage/0,11855,7-40109-22-86706278-0,00.html
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Coenen, M. (2007). IC MODELLING FOR EMC New Developments. In: Van Roermund, A.H., Casier, H., Steyaert, M. (eds) Analog Circuit Design. Springer, Dordrecht. https://doi.org/10.1007/1-4020-5186-7_12
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DOI: https://doi.org/10.1007/1-4020-5186-7_12
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-5185-2
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