Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
5.11 References
Allen DM (1986) The principles and practice of photochemical machining and photoetching. Inst of Physics Pub Inc. pp 1–18
Allongue P, Kieling VC, Gerischer H (1993) Etching of Si in NaOH solutions, Part I and II, J. Electrochem. Soc. 40:1009–1018 and 40:1018-1026
Ammar ES, Rodgers TJ (1980) UMOS transistors on (110) silicon, IEEE Trans. Electron Devices ED-27:907–914
Bassous E, Taub HH, Kuhn L (1977) Ink jet printing nozzle arrays etched in silicon, Appl. Phys. Lett. 31:135–137
Boivin LP (1974) Thin film laser-to fiber coupler, Appl. Opt. 13:391–395
Editorial (2004) Analog Devices combines micromachining with BICMOS, Semiconductor International, available at http://www.reed-electronics.com
Editorial (1974) Transducers, pressure and temperature catalog. White paper, National Semiconductor, Sunnyvale, USA
Editorial (1977) Thermal character print head. Technical Report, Texas Instruments, Austin
Gad-el-Hak M (2002) The MEMS handbook. CRC press, pp 200–211
Greenwood JC (1969) Ethylene Diamine-Cathechol-Water mixture shows preferential etching of p-n junction, J. Electrochem. Soc. 116:1325–1326
Greenwood JC (1984) Etched silicon vibrating sensor, J. Phys. E, Sci. Instrum. 17: 650–652
Hallas CE (1971) Electropolishing silicon, Solid State Technology 14:30–32
Harris TW (1976) Chemical Milling. Clarendon Press, Oxford
Hoffmeister W (1969) Determination of the etch rate of silicon in buffered HF using a 31 Si tracer method, Int. J. Appl. Radiation and Isotopes 2:139
Hu JZ, Merkle LD, Menoni CS, Spain IL (1986) Crystal data for high-pressure phases of silicon, Phys. Rev. B 34:4679–4684
Kaminsky G (1985) Micromachining of silicon mechanical structures, J. Vac. Sci. Technol., B3:1015–1024
Kern W, Deckert CA (1978) Chemical etching in thin film processes. Vossen JL, Kern W (eds) Academic Press, Orlando
Lee JB, Chen Z, Allen MG, Rohatgi A, Arya R (1995) A miniaturised high-voltage solar cell array as an electrostatic MEMS power supply, J. Microelectromech. Syst. 4: 102–108
Linde H, Austin L (1992) Wet silicon etching with aqueous amine gallates, J. Electrochem. Soc. 139:1170–1174
Madou MJ (1997) Fundamentals of microfabrication, CRC Press, New York
Madou MJ, Morrison SR (1989) Chemical sensing with solid state devices. Academic Press, New York
Michalicek AM (2004) Introduction to MEMS. http://mems.colorado.edu/c1.res.ppt /ppt/g.tutorial
Murarka SP, Retajczyk TFJ (1983) Effect of phosphorous doping on stress in silicon and polycrystalline silicon, J. Appl. Phys. 54:2069–2072
O’Neill P (1980) A monolithic thermal converter, Hewlett-Packard J. 31:12–13
Palik ED, Faust JW, Gray HF, Green RF (1982) Study of the Etch-Stop Mechanism in Silicon, J. Electrochem. Soc. 129:2051–2059
Peeters E (1994) Process development for 3D silicon microstructures, with application to mechanical sensor design, Ph.D. thesis, Catholic University of Louvain
Petersen KE (1982) Silicon as a mechanical material, Proc. IEEE, 70:420–457
Pfann WG (1961) Improvement of semiconducting devices by elastic strain, Solid State Electron. 3:261–267
Robbins H, Schwartz B (1960) Chemical etching of silicon-II: The system HF, HNO3, H2O, and HC2C3O2, J. Electrochem. Soc. 107:108–111
Rodgers TJ, Hiltpold WR, Frederick B, Barnes JJ, Jenné FB, Trotter JD (1977) VMOS memory technology, IEEE J. Solid-State Circuits SC 12:515–523
Schwartz B, Robbins H (1976) Chemical etching of silicon-IV, Etching Technology, J. Electrochem. Soc. 123:1903–1909
Smith CS (1954) Piezoresistance effect in germanium and silicon, Phys. Rev., 94: 42–49
Tuck B (1975) The chemical polishing of semiconductors, J. Mater. Sci. 10:321–339
Tuft ON, Chapman PW, Long D (1962) Silicon diffused-element piezoresistive diaphragms, J. Appl. Phys. 33:3322
Turner DR, (1958) Electropolishing silicon in hydrofluoric acid solutions, J. Electrochem. Soc. 105:402–408
Uhlir A (1956) Electrolytic shaping of germanium and silicon, Bell Syst. Tech. J. 35:333–347
Waggener HA, Krageness RC, Tyler AL (1967) Two-way etch, Electronics 40:274
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2006 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Bag, S.K. (2006). Characterising Etching Processes in Bulk Micromachining. In: Micromanufacturing and Nanotechnology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-29339-6_5
Download citation
DOI: https://doi.org/10.1007/3-540-29339-6_5
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-25377-8
Online ISBN: 978-3-540-29339-2
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)