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Some Aspects of Microchannel Heat Transfer

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Nano-Bio- Electronic, Photonic and MEMS Packaging

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Abstract

Systems for energy conversion, heat rejection, and sensing and control often incorporate heat exchange devices. Recent developments in microfabrication and assembly methods have led to significant miniaturization of these systems. Miniaturized heat exchange devices have commonly utilized microchannel flow passages. This chapter reviews the fundamental flow and heat-transfer phenomena in microchannels, the most common numerical and experimental characterization techniques, microfabrication methods, and the application of microchannels in thermal management of high heat flux electronics. The range of channel hydraulic diameters covered in this chapter is from a few micrometers to a few millimeters where the larger diameter transport characteristics become valid.

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Authors and Affiliations

  1. School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Y. Joshi & K. Kota

  2. IBM Corporation, Armonk, NY, USA

    X. Wei & B. Dang

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  1. Y. Joshi
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  2. X. Wei
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  3. B. Dang
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  4. K. Kota
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Correspondence to Y. Joshi .

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Editors and Affiliations

  1. School of Materials Science &, Georgia Institute of Technology, Ferst Drive NW., 771, Atlanta, 30332-0245, U.S.A.

    C.P. Wong

  2. School of Materials Science &, Georgia Institute of Technology, Ferst Drive NW., 771, Atlanta, 30332-0245, U.S.A.

    Kyoung-Sik Moon

  3. CH5-159, Intel Corporation, W. Chandler Blvd. 5000, Chandler, 85226, U.S.A.

    Yi (Grace) Li

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Joshi, Y., Wei, X., Dang, B., Kota, K. (2010). Some Aspects of Microchannel Heat Transfer. In: Wong, C., Moon, KS., Li, Y. (eds) Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0040-1_13

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