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Current Technologies on Electronics Cooling and Scope for Further Improvement: A Typical Review

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Proceedings of the International Conference on Industrial and Manufacturing Systems (CIMS-2020)

Part of the book series: Lecture Notes on Multidisciplinary Industrial Engineering ((LNMUINEN))

Abstract

The ongoing accentuation on laptops and PCs has resulted in a transformed enthusiasm for the improvement of higher performance cooling systems. The gigantic heat produced in laptops and PCs chip or enormous integrated circuit raises lots of exigent problems to be settled. The improvement within a cooling of electronic components needs the compact heat dissipation mechanism which gives higher performance. By the technological progression of several electronics equipment, liquid coolants were utilized progressively in PCs, servers, and supercomputers. This review article covers the characteristics of heat transfer for several cooling technologies with its possible applicability to the field of electronics cooling. Several cooling technologies like conventional air cooling method, indirect liquid cooling by single/two-phase methods, and heat pipes have been examined in the study. The characteristics for performance evaluated based on values of heat flux, temperature and flow rate of coolant; which serve as pointers for limitations of various heat transfer and power prerequisites of individual cooling arrangement. An increase in the heating load, higher will be a decrement in the temperature occurred due to the cooling mechanism. In consideration of common computing methods, air cooling remains a reasonable choice as heat loads of every processor are limited to 190 W, albeit different factors like operational cost, reliability of device and recovery of waste heat might even now energize a utilization of liquid cooling. The liquid cooling is relied upon to be important into future thermal management of the laptop, where both proficient cooling and incredibly lower energy utilization are of significant role.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Institute of Technology, Raipur, India

    K. R. Aglawe & R. K. Yadav

  2. Department of Mechanical Engineering, D. J. Sanghvi College of Engineering, Mumbai, India

    S. B. Thool

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  1. K. R. Aglawe
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  2. R. K. Yadav
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  3. S. B. Thool
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  1. Department of Industrial and Production Engineering, Dr. B. R. Ambedkar National Institute of Technology, Jalandhar, Punjab, India

    Ravi Pratap Singh

  2. Department of Industrial and Production Engineering, Dr. B. R. Ambedkar National Institute of Technology, Jalandhar, Punjab, India

    Dr Mohit Tyagi

  3. Dr. B. R. Ambedkar National Institute of Technology, Jalandhar, Punjab, India

    Dilbagh Panchal

  4. Department of Mechanical Engineering, Campus Santiago, University of Aveiro, Aveiro, Portugal

    J. Paulo Davim

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Aglawe, K.R., Yadav, R.K., Thool, S.B. (2022). Current Technologies on Electronics Cooling and Scope for Further Improvement: A Typical Review. In: Pratap Singh, R., Tyagi, D.M., Panchal, D., Davim, J.P. (eds) Proceedings of the International Conference on Industrial and Manufacturing Systems (CIMS-2020). Lecture Notes on Multidisciplinary Industrial Engineering. Springer, Cham. https://doi.org/10.1007/978-3-030-73495-4_27

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