Abstract
Thermal control is a key aspect of large-scale HPC centers, where a large number of computing elements is employed. Temperature is directly related to both reliability, as excessing heating of components leads to a shorter lifespan and increased fault probability, and power efficiency, since a large fragment of power is used in the cooling system itself. In this paper, we introduce the TEXTAROSSA approach to thermal control, which couples innovative two-phase cooling with multi-level thermal control strategies able to address thermal issues at system and node level.
This work is supported in part by the EuroHPC JU and the Italian Ministry for Economic Development (MiSE) under GA 956831 “TEXTAROSSA”.
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Notes
- 1.
https://www.etp4hpc.eu/sra.html (last accessed June 2022).
- 2.
https://prace-ri.eu (last accessed June 2022).
- 3.
https://cordis.europa.eu/project/id/248749 (last accessed June 2022).
- 4.
https://www.consorzio-cini.it/index.php/it/laboratori-nazionali/hpc-key-technologies-and-tools (last accessed March 2022).
- 5.
https://textarossa.eu (last accessed March 2022).
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Fornaciari, W. et al. (2022). The TEXTAROSSA Approach to Thermal Control of Future HPC Systems. In: Orailoglu, A., Reichenbach, M., Jung, M. (eds) Embedded Computer Systems: Architectures, Modeling, and Simulation. SAMOS 2022. Lecture Notes in Computer Science, vol 13511. Springer, Cham. https://doi.org/10.1007/978-3-031-15074-6_27
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