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Control of Thermal Contact Conductance Using Interstitial Materials and Coatings

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Book cover Thermal Contact Conductance

Part of the book series: Mechanical Engineering Series ((MES))

Abstract

As noted in Chapter 1, the actual solid-to-solid contact area, in most mechanical joints, is only a small fraction of the apparent area. The voids between the actual contact spots are usually occupied by some conducting substance such as air. Other interstitial materials may be deliberately introduced to control, that is, either to enhance or to lessen, the TCC: examples include foils, powders, wire screens and epoxies. To enhance the conductance the bare metal surfaces may also be coated with metals of higher thermal conductivity by electroplating or vacuum deposition. Greases and other lubricants also provide alternative means of enhancing the TCC.

An erratum to this chapter is available at 10.1007/978-3-319-01276-6_11

An erratum to this chapter can be found at http://dx.doi.org/10.1007/978-3-319-01276-6_11

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  1. 31 Dawes, St Little Bay, Sydney, NSW, 2036, Australia

    C. V. Madhusudana

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Madhusudana, C.V. (2014). Control of Thermal Contact Conductance Using Interstitial Materials and Coatings. In: Thermal Contact Conductance. Mechanical Engineering Series. Springer, Cham. https://doi.org/10.1007/978-3-319-01276-6_7

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  • DOI: https://doi.org/10.1007/978-3-319-01276-6_7

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  • Print ISBN: 978-3-319-01275-9

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