Abstract
Optical interconnects hold the promise of revolutionizing computing speed having higher bandwidth and lower power consumption. For high packing density of optical interconnects, crosstalk is calculated considering the coupling of fields of two parallel identical neighboring waveguides. The study shows that there exists minimum pitch for a particular length and width of the interconnects to avoid significant amount of crosstalk. Again, an optimum ratio of width-to-pitch exists for which crosstalk is minimum.
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Agarwalla, P., Das, N.R. (2014). Effect of Packing Density on Crosstalk in On-chip Optical Interconnects. In: Jain, V., Verma, A. (eds) Physics of Semiconductor Devices. Environmental Science and Engineering(). Springer, Cham. https://doi.org/10.1007/978-3-319-03002-9_212
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DOI: https://doi.org/10.1007/978-3-319-03002-9_212
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-03001-2
Online ISBN: 978-3-319-03002-9
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