Summary
We present a micromachined mirror array for use in adaptive optics. Piston motions of more than 6 µm as well as tip/tilt motions of 11 mrad (0.65°) are demonstrated. Single-crystal-silicon mirrors are assembled onto electrostatic parallel-plate actuators. The actuators lift off the substrate after microstructure release as a consequence of residual stresses in nickel-polysilicon bimorph flexures. The assembled mirrors provide fill factors of 95%. Peak-to-valley surface variations are smaller than 30 nm over a 464 µm-diameter (vertex-to-vertex) mirror segment.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
T. Bifano and R. K. Mali, “MEMS Deformable Mirror for Adaptive Optics,” 1998 Int’l Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 71–74, 1998.
W. D. Cowen, M. K. Lee, B. M. Welsh, V. M. Bright, and M. C. Roggemann, “Surface Micromachined Segmented Mirrors for Adaptive Optics,” IEEE J. of Selected Topics in Q.E, Vol 5., pp. 90–101, 1999.
O. Cugat, P. Mounaix, S. Basrour, C. Divoux, and G Reyne, “Deformable Magnetic Mirror for Adaptive Optics: First Results,” Proc. IEEE 13th Annual Int’l Conf. on MEMS, Miyazaki, Japan, pp. 485–490, 2000.
A. Tuantranont, V. M. Bright, L.-A. Liew, W. Zhang, and Y. C. Lee, “Smart Phase-Only Micromirror Array Fabricated by Standard CMOS Process,” Proc. IEEE 13th Annual Int’l Conf. on MEMS, Miyazaki, Japan, pp. 455–460, 2000.
G-D. J. Su, L. Fan, and M. C. Wu, “Surface-microma-chined Adaptive Micromirror Arrays with Large Strokes,” MOEMS 99, 3rd Int’l. Conf. on Micro Opto Electro Mechanical Systems, Mainz, Germany, pp. 39–43, 1999.
P. R. Patterson, G-D. J. Su, H. Toshiyoshi, and M. C. Wu, “A MEMS 2-D Scanner with Bonded Single-Crystalline Honeycomb Mirror,” Proc. 2000 Int’l Workshop on Solid-State Sensors and Actuators, Hilton Head, SC, pp. 17–18, June 2000.
A. Tuantranont L.-A. Liew, V. M. Bright, J. Zhang; W. Zhang, and Y. C. Lee, “Bulk-Etched Surface Micromachined and Flip-Chip Integrated Micromirror Array for Infrared Applications,” 2000 IEEE/LEOS Int’l Conf. on Optical MEMS, Kauai, HI, pp. 71–72, 2000.
U. Srinivasan, D. Liepmann, and R. T. Howe, “Micro-structure to Substrate Self-Assembly Using Capillary Forces,” J. of MEMS, Vol. 10, 2001.
U. Srinivasan, M. A. Helmbrecht, C. Rembe, R. S. Muller, and R. T. Howe, “Fluidic Self-Assembly of Micromirrors onto Surface Micromachined Actuators,” Proc. 2000 IEEE/LEOS Int’l Conf. on Optical MEMS, Kauai, HI, pp. 59–60, 2000.
S. Timoshenko, Collected papers, New York, McGraw-Hill, pp. 403–421, 1953.
W. Riethmüller and W. Benecke, “Thermally Excited Silicon Microstructures,” IEEE Trans, on Electron Devices, Vol. 35, pp. 758–763, 1988.
M. W. Judy, Y-H. Cho, R. T. Howe, and A. P. Pisano, “Self-Adjusting Microstructures (SAMS),” IEEE Micro Electro Mechanical Systems Workshop, Nara, Japan, pp. 51–56,1991.
R. T. Chen, H. Nguyen, and M. C. Wu, “A Low Voltage Micromachined Optical Switch by Stress Induced Bending,” Proc. of IEEE 12th Int’l. Workshop on MEMS, Orlando, FL, pp. 424–428, 1999.
E. P. Popov and T. A. Balan, Engineering Mechanics of Solids, 2nd. Edition, Prentice Hall, 1998.
H. Guckel, D. W. Burns, H. A. C. Tilmans, D. W. DeRoo, and C. R. Rutigliano, “Mechanical Properties of Fine Grained Polysilicon-the Repeatability Issue,” 1988 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 96–99, 1988.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2001 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Helmbrecht, M.A., Srinivasan, U., Rembe, C., Howe, R.T., Muller, R.S. (2001). Micromirrors for Adaptive-Optics Arrays. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_297
Download citation
DOI: https://doi.org/10.1007/978-3-642-59497-7_297
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-42150-4
Online ISBN: 978-3-642-59497-7
eBook Packages: Springer Book Archive