Zusammenfassung
Der Trend zur Anordnung von mikroelektronischen Bauelementen auf kleinstem Raum stellt zunehmend höhere Anforderungen an das dazugehörige Kühlsystem. Trotz zeitweise auftretender flächenspezifischer Dissipationsleistungen von mehr als 10 W/cm2 dürfen die Temperaturen wegen der stets vorhandenen Lötstellen nicht über 125°C steigen.
Bearbeiter des Abschnitts Haa: Dr.-Ing. J. J. Schröder, Hannover
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Verein Deutscher Ingenieure., VDI-Gesellschaft Verfahrenstechnik und Chemieingenieurwesen (GVC). (1997). Behältersieden unterkühlter Flüssigkeiten (Sieden bei freier Konvektion). In: VDI-Wärmeatlas. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-10745-4_8
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