Abstract
Electron Beam Lithography (EBL) is a fundamental technique of nanofabrication, allowing not only the direct writing of structures down to sub-10 nm dimensions, but also enabling high volume nanoscale patterning technologies such as (DUV and EUV) optical lithography and nanoimprint lithography through the formation of masks and templates. This chapter summarizes the key principles of EBL and explores some of the complex interactions between relevant parameters and their effects on the quality of the resulting lithographic structures. The use of low energy exposure and cold development is discussed, along with their impacts on processing windows. Applications of EBL are explored for the fabrication of very small isolated bridge structures and for high density master masks for nanoimprint lithography. Strategies for using both positive and negative tone resists are explored.
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Acknowledgements
The authors are grateful for the support of the Natural Sciences and Engineering Research Council of Canada, the National Institute for Nanotechnology, the Alberta Ingenuity Fund, Raith GmbH, and the University of Alberta NanoFab.
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Mohammad, M.A., Muhammad, M., Dew, S.K., Stepanova, M. (2012). Fundamentals of Electron Beam Exposure and Development. In: Stepanova, M., Dew, S. (eds) Nanofabrication. Springer, Vienna. https://doi.org/10.1007/978-3-7091-0424-8_2
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DOI: https://doi.org/10.1007/978-3-7091-0424-8_2
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