Abstract
This paper begins with a discussion of the physical phenomena associated with thermally-induced/accelerated failures, including diffusion-driven and thermo-mechanical failure mechanisms. Attention is then turned to the results of ongoing Northern Telecom “field-return” surveys and to the identification of the factors controlling device field reliability for newly designed equipment, mature technologies in mild environments, and equipment operated under harsh environmental conditions. It is concluded that new reliability models and figures-of-merit, based on the phenomenological understanding of the failure mechanisms, are needed in order to predict the thermal dependence of the probability of failure.
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© 1994 Springer Science+Business Media Dordrecht
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Bar-Cohen, A., Witzman, S. (1994). Analysis and Prevention of Thermally Induced Failures in Electronic Equipment. In: Hoogendoorn, C.J., Henkes, R.A.W.M., Lasance, C.J.M. (eds) Thermal Management of Electronic Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1082-2_2
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DOI: https://doi.org/10.1007/978-94-011-1082-2_2
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