Abstract
The present study focuses on the analytical determination of the thermally-induced stresses in a convectively-cooled PDIP package. A model of thermal conduction inside the plastic package is combined with a methodology for the computation of the thermal resistance in the convective boundary layer to yield the internal temperature field. The component temperature distribution, obtained in this manner, is then used, via first-order elastic thermal stress relations, to determine the stresses both within the constituent materials and along the interfaces among them.
The analytical results provide insight into the potential failure mechanisms of this package and are found to compare well with a detailed finite-element solution of the temperature and strain/stress fields.
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© 1994 Springer Science+Business Media Dordrecht
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Witzman, S., Mix, D.E., Bar-Cohen, A. (1994). Thermal Stress In Convectively-Cooled Plastic-Encapsulated Chip Packages. In: Hoogendoorn, C.J., Henkes, R.A.W.M., Lasance, C.J.M. (eds) Thermal Management of Electronic Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1082-2_28
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DOI: https://doi.org/10.1007/978-94-011-1082-2_28
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