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Cooling of Electronic Systems pp 539–621Cite as

Immersion Cooling of Digital Computers

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Part of the book series: NATO ASI Series ((NSSE,volume 258))

Abstract

The present work reviews the theory and practice of direct liquid cooling of microelectronic components. A morphological analysis is suggested for the classification of liquid-cooling concepts. While both immersion and microgroove cooling of chips are discussed, the emphasis is on immersion cooling. The performance of individual chips and liquid incapsulated modules, including the submerged condenser, is reviewed in detail, with data presented. Flow-through modules and falling-film techniques are also discussed. Finally, figures-of-merit for coolants are noted.

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Author information

Authors and Affiliations

  1. Rensselaer Polytechnic Institute, Troy, NY, 12180-3590, USA

    Arthur E. Bergles (Clark and Crossan Professor of Engineering)

  2. Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN, 55455-0111, USA

    Avram Bar-Cohen

Authors
  1. Arthur E. Bergles
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  2. Avram Bar-Cohen
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Editors and Affiliations

  1. University of Miami, Coral Gables, Florida, USA

    S. Kakaç

  2. Middle East Technical University, Ankara, Turkey

    H. Yüncü

  3. Tokyo Institute of Technology, Tokyo, Japan

    K. Hijikata

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© 1994 Springer Science+Business Media Dordrecht

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Bergles, A.E., Bar-Cohen, A. (1994). Immersion Cooling of Digital Computers. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_23

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  • DOI: https://doi.org/10.1007/978-94-011-1090-7_23

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