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Integrated CMOS Sensor Technologies for the CLIC Tracker

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Proceedings of International Conference on Technology and Instrumentation in Particle Physics 2017 (TIPP 2017)

Abstract

Integrated technologies are attractive candidates for an all silicon tracker at the proposed future multi-TeV linear \(\mathrm {e^{+} e^{-}}\) collider CLIC. In this context CMOS circuitry on a high resistivity epitaxial layer has been studied using the ALICE Investigator test-chip. Test-beam campaigns have been performed to study the Investigator performance and a Technology Computer Aided Design based simulation chain has been developed to further explore the sensor technology.

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Acknowledgements

The author would like to thank Walter Snoeys, Jacobus Van Hoorne and Krzysztof Sielewicz from the ALICE collaboration for providing the Investigator readout system, sharing the chips during the test beam campaigns and many helpful discussions. Work sponsored by the Wolfgang Gentner Programme of the Federal Ministry of Education and Research.

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Correspondence to Magdalena Munker .

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Munker, M., on behalf of the CLICdp Collaboration. (2018). Integrated CMOS Sensor Technologies for the CLIC Tracker. In: Liu, ZA. (eds) Proceedings of International Conference on Technology and Instrumentation in Particle Physics 2017. TIPP 2017. Springer Proceedings in Physics, vol 213. Springer, Singapore. https://doi.org/10.1007/978-981-13-1316-5_67

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