Abstract
In this chapter, advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-count, and metal linewidth and spacing for advanced packaging, are examined.
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Lau, J.H. (2023). State-Of-The-Art of Advanced Packaging. In: Chiplet Design and Heterogeneous Integration Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-19-9917-8_1
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