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The influence of oxygen on wetting and bonding in the copper-tungsten system

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Abstract

The influence of the oxygen content of copper on its wetting of, and bonding to, tungsten has been investigated in detail using sessile-drop and pull-out strength tests. As little as 41 ppm of oxygen has been found to inhibit wetting and to result in bond strengths of less than 2 ton/in.2 (3.2 kg/mm2).

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References

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Authors and Affiliations

  1. Metallurgy Division, Atomic Energy Research Establishment, Harwell, Berks, UK

    M. Nicholas & D. M. Poole

Authors
  1. M. Nicholas
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  2. D. M. Poole
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Nicholas, M., Poole, D.M. The influence of oxygen on wetting and bonding in the copper-tungsten system. J Mater Sci 2, 269–274 (1967). https://doi.org/10.1007/BF00555384

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  • DOI: https://doi.org/10.1007/BF00555384

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