Abstract
Photoacoustic Spectroscopy (PAS) has been used to measure the thickness of thin SiO2 films grown on (100) Si wafers. The data are in reasonable agreement with a simple theoretical model. It suggests that photoacoustic Spectroscopy is complementary to optical interferometry, in that it is capable of giving quantitative estimates of thin transparent films on opaque substrates of low reflectivity via the transmitted fraction of the optical energy incident on the sample. Both theoretical and experimental results indicate that PAS can be very useful in the measurement of thin films on substrates of low reflectivity.
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