Abstract
The effects of compositional and microstructural variables and processing conditions on the room temperature thermal diffusivity of hot-pressed and reaction-sintered silicon nitride were determined. The thermal diffusivity for hot-pressed silicon nitride increases withβ-content. Maximum thermal diffusivity is reached at about 3 wt % MgO. The higher thermal diffusivity of the β-phase is attributed to its higher purity level and the less distorted crystal structure compared to theα-phase. In reaction-sintered nitride the thermal diffusivity is strongly influenced by the relative amount and needle-like morphology of theα-phase. Correlations of the thermal diffusivity with mechanical properties are discussed.
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Ziegler, G., Hasselman, D.P.H. Effect of phase composition and microstructure on the thermal diffusivity of silicon nitride. J Mater Sci 16, 495–503 (1981). https://doi.org/10.1007/BF00738642
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DOI: https://doi.org/10.1007/BF00738642