Abstract
A metallographic study of diffusion bonds between aluminium and copper has been made in order to further understanding of the mechanism of bond formation for joints between dissimilar metals that form intermediate phases or intermetallic compounds. A three-stage mechanistic model based upon sintering principles has been proposed to explain this kind of diffusion joint.
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Calvo, F.A., Ureng, A., Gomez De Salazar, J.M. et al. Special features of the formation of the diffusion bonded joints between copper and aluminium. J Mater Sci 23, 2273–2280 (1988). https://doi.org/10.1007/BF01115800
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DOI: https://doi.org/10.1007/BF01115800