Half-fringe photoelasticity: A new approach to whole-field stress analysis

Abstract

This paper presents a new method for whole-field stress analysis based on a symbiosis of two techniques—classical photoelasticity and modern digital image analysis. The resulting method is called ‘half-fringe photoelasticity (HFP)’.

Classical photoelasticity demands materials with high birefringence, which leads to extensive use of plastics as model materials. Since the behavior of these materials is often different from that of the prototype materials, their use distorts the similitude relationships. In many contemporary problems this distortion is untenable. HFP offers a way out of this dilemma. It permits materials and loads to be chosen so that no more than one half of a fringe order appears in the area of interest. Thus, for example, glass, which behaves linearly up to high stress levels and over a wide range of temperatures, could be used as model material. Alternatively, models from polymeric materials could be used under very low load in order to stay within the linear part of the stress-strain diagram and to prevent large deformations. The half-fringe-photoelasticity system, which is described here, utilizes the resulting low levels of birefringence for effective stress analysis.

This paper describes the system. It outlines a calibration routine and illustrates its application to two simple problems using glass models.