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Stress measurement by copper electroplating based on grain growth

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Abstract

This paper presents a stress measurement method using the grain-growth phenomenon in the copper-electroplated layer by cyclic loading. The growth rate of grains by cyclic loading is related to the stress amplitude. The relation between grain area and number of stress cycles was observed under various stress amplitudes and the relation between grain growth rate and the stress amplitude was obtained. The grain area was measured by an image-processing system using a personal computer. Because grain-growth rate depends on the amplitude of stress, surface stress can be estimated from the grain-growth rate based on this relation. For grain size in the range from 0.01 to 0.1 mm, stress in a very small region can be measured based on the growth of grains. Stress measurement was actually carried out using this method. The result showed that the error was less than 1.0 percent, confirming that this method is sufficiently accurate.

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References

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Kato, A. Stress measurement by copper electroplating based on grain growth. Experimental Mechanics 35, 24–30 (1995). https://doi.org/10.1007/BF02325830

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  • DOI: https://doi.org/10.1007/BF02325830

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