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Experimental modal analysis for microelectromechanical systems

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Abstract

The structural dynamics behavior of microelectromechanical systems (MEMS), which include moving, overhung, and compliant subcomponents, plays a pivotal role in determining their performance and reliability. Traditionally, experimental modal analysis is used to characterize the dynamic behavior of structures, as well as to derive, validate, update, and correct analytical and numerical models. Due to their small size, however, conventional modal testing methods cannot be directly applied to microstructures. In this paper we provide an overview of modal testing techniques for microsystems. A particular experimental modal analysis methodology that includes base excitation via a piezoelectric shaker and measurement through a laser interferometer is then described and evaluated. A distinguishing characteristic of the methodology is its simplicity, including its simple setup and off-the-shelf components. The modal model is derived for the base excitation of microcantilever beams. The effectiveness of the methodology is illustrated through various experiments on polysilicon microcantilevers for different geometries and ambient pressures. Analysis of the damping data for different pressures has confirmed the well-documented fact that the structural damping in microsystems can be considerably less than damping arising from interaction with the ambient gases.

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References

  1. Rembe, C., Tibken, B., andHofer, E., “Analysis of the Dynamics in Microactuators Using High-speed Cine Photomicrography,”Journal of Microelectromechanical Systems,10 (1),137–145 (2001).

    Article  Google Scholar 

  2. Shi, E., Ramesh, P., andMukherjee, S., “Dynamic Analysis of Microelectromechanical Systems,”International Journal of Numerical Methods in Engineering,39 (24),4119–4139 (1996).

    Article  Google Scholar 

  3. Eaton, W., Smith, N., Irwin, L., andTanner, D., “Characterization Techniques for Surface-micromachined Devices,”Proceedings of the SPIE,3514,431–438 (1998).

    Article  Google Scholar 

  4. Schnitzer, R., Ruemmler, N., Grosser, V., andMichel, B., “Vibration Measurement of Microstructures by Means of Laser Optical Modal Analysis,”Proceedings of the SPIE,3825,72–79 (1999).

    Article  Google Scholar 

  5. LaVigne, G.F. and Miller, S.L., “A Performance Analysis System for MEMS Using Automated Imaging Methods,” Proceedings of the IEEE International Testing Conference, Washington, DC, 442–447 (1998).

  6. Ngoi, B., Venkatakrishnan, K., Tan, B., Noel, N., Shen, Z., andChin, C., “Two-axis-scanning Laser Doppler Vibrometer for Microstructure,”Optics Communications,182 (1–3),175–185 (2000).

    Article  Google Scholar 

  7. Lai, W.-P. andFang, W., “Novel Bulk Acoustic Wave Hammer to Determinate the Dynamic Response of Microstructures Using Pulsed Broad Bandwidth Ultrasonic Transducers,”Sensors and Actuators A: Physical,96,43–52 (2002).

    Article  Google Scholar 

  8. Ewins, D.J., Modal Testing: Theory Practice and Application, 2nd edition, Research Studies Press, Baldock, Hertfordshire, UK (2000).

    Google Scholar 

  9. Maia, N.M.M. andde Silva, J.M.M., editors, Theoretical and Experimental Modal Analysis.Research Studies Press, Taunton, Somerset, UK (1997).

    Google Scholar 

  10. Burdess, J., Harris, A., Wood, D., Pitcher, R., andGlennie, D., “A System for the Dynamic Characterization of Microstructures,”Journal of Microelectromechanical Systems,6 (4),322–328 (1997).

    Article  Google Scholar 

  11. Chou, Y.F. andWang, L.C., “On the Modal Testing of Microstructures: Its Theoretical Approach and Experimental Setup,”ASME Journal of Vibration and Acoustics,123 (1),104–109 (2001).

    Article  Google Scholar 

  12. Zhang, P.Q., Wang, Q.M., Tang, X.O., andHuang, T.C., “Experimental Research on Dynamic Properties of Mini-small Object,”Proceedings of the International Modal Analysis Conference (IMAC), Florence, Italy, April 15–18, Vol 2, 1528–1535 (1991).

    Google Scholar 

  13. Chen, J.S., Su, C.P., andChou, Y.F., “Modal Analysis for Miniature Structures,”Proceedings of the International Modal Analysis Conference (IMAC), Nashville, TN, February, Vol 5, 969–975 (1995).

    Google Scholar 

  14. Zhang, P., Tang, X., Shan, B., Brandon, J., andKwan, A., “Analytical and Experimental Modal Analysis for Operational Validation and Calibration of a Miniature Silicon Sensor,”Journal of Sound and Vibration,214 (5),903–913 (1998).

    Article  Google Scholar 

  15. Ye, X.Y., Zhou, Z.Y., Yang, Y., Zhang, J.H., andYao, J., “Determination of the Mechanical Properties of Microstructures,”Sensors and Acuators A: Physical,54,750–754 (1996).

    Article  Google Scholar 

  16. Hoummady, M., Farnault, E., Kawakatsu, H., andMasuzawa, T., “Applications of Dynamic Techniques for Accurate Determination of Silicon Nitride Young's Moduli,”Proceedings of the International Conference on Solid-State Sensors and Actuators, Vol. 1, 615–618 (1997).

    Article  Google Scholar 

  17. Smith, N., Tanner, D., Swanson, S., and Miller, S., “Non-destructive Resonant Frequency Measurement on MEMS Actuators,” Proceedings of the IEEE International Reliability Physics Symposium, 30 April–3 May, Orlando, FL, 99–105 (2001).

  18. Zook, J., Burns, D., Guckel, H., Sniegowski, J., Engelstad, R., andFend, Z., “Characteristics of Polysilicon Resonant Microbeams,”Sensors and Actuators A: Physical,35 (1),51–59 (1992).

    Article  Google Scholar 

  19. Yasumura, K., Stowe, T., Chow, E., Pfafman, T., Kenny, T., Stipe, B., andRugar, D., “Quality Factors in Micron- and Submicron-thick Cantilevers,”Journal of Microelectromechanical Systems,9 (1),117 (2000).

    Article  Google Scholar 

  20. Ijntema, D.J. andTilmans, H.A.C., “Static and Dynamic Aspects of an Air-gap Capacitor,”Sensors and Actuators A: Physical,35 (2),121–128 (1992).

    Article  Google Scholar 

  21. Tilmans, H.A.C., IJntema, D.J., and Fluitman, J.H.J., “Single Element Excitation and Detection of (Micro)Mechanical Resonators,” Proceedings of the International Conference on Solid-State Sensors and Actuators (TRANSDUCERS '91), San Francisco, CA, 533–537 (1991).

  22. Burns, D.J. andHelbig, H.F., “A System for Automatic Electrical and Optical Characterization of Microelectromechanical Devices,”Journal of Microelectromechanical Systems,8 (4),473–482 (1999).

    Article  Google Scholar 

  23. Bouwstra, S., Tilmans, H.A.C., Selvakumar, A., and Najafi, K., “Base Driven Micromechanical Resonators,” Proceedings of the IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, 148–152 (1992).

  24. Zalalutdinov, M., Zehnder, A., Olkhovets, A., Turner, S., Sekaric, L., Ilic, B., Czaplewski, D.A., Parpia, J.M., andCraigead, H.G., “Autoparameter Drive for Micromechanical Oscillators,”Applied Physics Letters,79 (5),695–697 (2001).

    Article  Google Scholar 

  25. Carne, T.G., Martinez, D.R., and Nord, A.R., “A Comparison of Fixed-base and Driven-base Modal Testing of an Electronics Package,” Proceedings of the International Modal Analysis Conference, Las Vegas, NV, 672–679 (1989).

  26. Lee, J.-C. andChou, Y.-F., “Driven-base Modal Parameter Estimation for Continuous Structures,”Proceedings of the International Modal Analysis Conference (IMAC), Florence, Italy, April 15–18, Vol. 1, 711–718 (1991).

    Google Scholar 

  27. Temesvary, V., Wu, S., Hsieh, W.H., Tai, Y.-C., andMiu, D.K., “Design Fabrication and Testing of Silicon Microgimbals for Super-compact Rigid Disk Drives,”Journal of Microelectromechanical Systems,4 (1),18–27 (1995).

    Article  Google Scholar 

  28. Burdess, J., Harris, A., Pitcher, R., Ward, M., King, D., and Wood, D., “Mechanical Characterization of a Polysilicon Accelerometer,” Proceedings of the IEE Colloquium on Silicon Fabricated Inertial Instruments, London, UK, 7/1–7/7 (1996).

  29. Hart, M., Conant, R., Lau, K., andMuller, R., “Stroboscopic Interferometer System for Dynamic MEMS Characterization,”Journal of Microelectromechanical Systems,9 (4),409–418 (2000).

    Article  Google Scholar 

  30. Cloud, G.L., Optical Methods of Engineering Analysis, Cambridge University Press, Cambridge (1995).

    Google Scholar 

  31. Zhang, P.Q., Wang, Q.M., Wu, X.P., andHuang, T.C., “Experimental Modal Analysis of Miniature Objects by Optical Measurement Technique,”International Journal of Analytical and Experimental Modal Analysis,7, (4),243–253 (1992).

    Google Scholar 

  32. de Boer, M.P., Luck, D.L., Walraven, J.A., and Redmond, J.M., “Characterization of an Inchworm Actuator Fabricated by Polysilicon Surface Micromachining,” Proceedings of the SPIE Reliability, Testing, and Characterization of MEMS/MOEMS, San Francisco, CA, 169–180 (2001).

  33. Turner, K.L., Hartwell, P.G., and Macdonald, N.C., “Multidimensional MEMS Motion Characterization Using Laser Vibrometry,” Proceedings of Transducers '99, the 10th International Conference on Solid-State Sensors and Actuators, Sendai, Japan, 1144–1147 (1999).

  34. Schwarz, B.J. and Richardson, M.H., “Experimental Modal Analysis,” Proceedings of the CSI Reliability Week, Orlando, FL (1999).

  35. Richardson, M.H. and Formenti, D.L., “Parameter Estimation from Frequency Response Measurements Using Rational Fraction Polynomials,” Proceedings of the International Modal Analysis Conference, Orlando, FL, 167–181 (1982).

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Ozdoganlar, O.B., Hansche, B.D. & Carne, T.G. Experimental modal analysis for microelectromechanical systems. Experimental Mechanics 45, 498–506 (2005). https://doi.org/10.1007/BF02427903

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  • DOI: https://doi.org/10.1007/BF02427903

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