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Enhanced tensile strength for electrodeposited nickel-copper multilayer composites

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Abstract

The tensile strength of electrodeposited layered composites of the nominal overall composition 90 pct Ni-10 pct Cu is shown to increase sharply to the 1300 MPa range as the thickness of the Cu layers is decreased below ~0.4 ώm. This tensile strength value is almost a factor of three greater than that measured for Ni itself, and more than a factor of two greater than the handbook value for Monel 400.

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Authors and Affiliations

  1. Rockwell International Science Center, Electrochemical Processes Group, 1049 Camino Dos Rios, P.O. Box 1085, 91360, Thousand Oaks, CA

    Dennis Tench (Manager) & John White (Senior Technical Associate)

Authors
  1. Dennis Tench
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  2. John White
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Tench, D., White, J. Enhanced tensile strength for electrodeposited nickel-copper multilayer composites. Metall Trans A 15, 2039–2040 (1984). https://doi.org/10.1007/BF02646838

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  • DOI: https://doi.org/10.1007/BF02646838

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