Abstract
Lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, are potential replacements for Sn-37Pb solder in low-cost electronic assembly. This paper reviews the literature on the microstructure and mechanical properties of these alloys. Because of the processing and testing conditions, many of the data are not predictive for electronic assembly applications. However, eutectic Sn-Bi seems to have properties approaching those of eutectic Sn-Pb under most conditions, while eutectic Sn-In seems far inferior in most respects. Eutectic Sn-Ag has many promising characteristics, but its relatively high melting temperature may preclude its use for this type of application.
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Glazer, J. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review. J. Electron. Mater. 23, 693–700 (1994). https://doi.org/10.1007/BF02651361
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DOI: https://doi.org/10.1007/BF02651361