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Investigation of multi-component lead-free solders

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Abstract

Binary phase diagrams of interest for lead-free solder development have been entered into the THERMO-CALC data base. These may be used directly to calculate multi-component phase relations vs temperature provided there are no ternary or higher order interactions. Such occur in the Sn-Ag-Zn system and are being evaluated. Contact angles of a number of solder-flux combinations on copper were directly measured in spreading tests. With a rosin-isopropyl alcohol flux, the contact angles of binary eutectic solders were in degrees: Sn-Bi at 166°C, 40; Sn-Zn at 225°C, 60; Sn-Ag at 250°C, 45. These angles were little affected by a number of 1% ternary additions to the solder. The contact angles were 20 degrees or less when SnCl2 was used as a flux. The SnCl2 reacts with Cu to form Cu3Sn. The most likely successful approach to obtain satisfactory wetting with lead-free solders appears to be development of a satisfactory flux.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Robert R. McCormick School of Engineering and Applied Science, Northwestern University, 60208-3108, Evanston, IL

    M. E. Loomans, S. Vaynman, G. Ghosh & M. E. Fine

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  1. M. E. Loomans
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  2. S. Vaynman
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  3. G. Ghosh
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  4. M. E. Fine
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Loomans, M.E., Vaynman, S., Ghosh, G. et al. Investigation of multi-component lead-free solders. J. Electron. Mater. 23, 741–746 (1994). https://doi.org/10.1007/BF02651368

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  • DOI: https://doi.org/10.1007/BF02651368

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