Abstract
The first application of MOCVD compositional grading by means of substrate temperature changes is reported for the case of GaAs−Px (0 ≤ x ≤ 0.30). The method is based upon the higher pyrolysis efficiency ratio of AsH3 relative to PH3 at lower growth temperatures. The growth upon GaAs substrates commences at a temperature at which this PH3/ASH3 thermal cracking efficiency ratio is extremely high; raising the growth temperature decreases this ratio, and hence the As/P ratio in the solid. GaAs1−xPx epilayers grown on GaAs by this method display excellent materials properties and are virtually optically and electrically indistinguishable from conventionally-graded epilayers in which the gas phase mole fractions of transport agents are varied at constant temperature. The method is applicable to systems where temperature-dependent cracking efficiency differentials exist.
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Lewis, C.R., Ludowise, M.J. The compositional grading of MOCVD-grown GaAs1−xPx via substrate temperature changes. J. Electron. Mater. 13, 749–761 (1984). https://doi.org/10.1007/BF02657924
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DOI: https://doi.org/10.1007/BF02657924