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Effect of stress during aging on the precipitation of θ′ in Al-4 Wt pct Cu

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Abstract

Experiments have been made on Al-4 wt pct Cu single crystals to determine the influence of stress, applied during aging, on precipitation. Without stress, θ platelets precipitate on all (100) planes. Transmission electron microscopy showed a marked effect of aging stress on the microstructure. A compressive stress of approximately 48 MPa (∼ 7,000 psi) parallel to [001] favored precipitation on (010) and (100) and inhibited precipitation on (001). When a tensile stress of similar magnitude was applied parallel to [001], precipitation was favored on (001) and inhibited on (010) and (100).

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Authors and Affiliations

  1. Department of Materials and Metallurgical Engineering, University of Michigan, 48104, Ann Arbor, Mich.

    William F. Hosford (Professor) & Suphal P. Agrawal (Post-Doctoral Research Associate)

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  1. William F. Hosford
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  2. Suphal P. Agrawal
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Hosford, W.F., Agrawal, S.P. Effect of stress during aging on the precipitation of θ′ in Al-4 Wt pct Cu. Metall Trans A 6, 487 (1975). https://doi.org/10.1007/BF02658406

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