Abstract
Contact angle measurements on silicon-nitride substrates were conducted on tin-based alloys, containing titanium and zirconium, to determine the suitability of these alloys as filler metals for low-temperature joining of ceramics. Titanium-containing alloys exhibited excellent wettability characterized by contact angles less than 20 deg, whereas the Zr-containing alloys exhibited contact angles around 50 deg. The superior wettability of the Sn−Ti alloys is attributed to the higher activity coefficient of Ti in Sn−Ti alloys. The liquidus temperature of the Sn−Ti alloys is in the 400°C to 600°C range. Hence, these alloys are expected to reduce the residual stress problem.
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M. Naka, K. Asami, I. Okamoto, and Y. Arata:Trans. JWRI, 1983, vol. 12, pp. 145–48.
M. Naka, K. Sampath, I. Okamoto, and Y. Arata:Trans. JWRI, 1983, vol. 12, pp. 181–83.
M. Naka, T. Tanaka, I. Okamoto, and Y. Arata:Trans. JWRI, 1983, vol. 12, pp. 177–80.
M. Naka, M. Ueki, and I. Okamoto:Trans. JWRI, 1985, vol. 14, pp. 193–94.
M. Naka and I. Okamoto:Trans. JWRI, 1985, vol. 14, pp. 29–34.
M. Naka, T. Tanaka, and I. Okamoto:Q. J. Jpn. Weld. Soc., 1986, vol. 4, p. 597.
M. Naka, K. Asami, and I. Okamoto:Q. J. Jpn. Weld. Soc., 1986, vol. 4, p. 321.
A.J. Moorhead:Weld. J., 1983, vol. 62, pp. 17–27.
M.G. Nicholas: U.S. Patent No. 4471026, Sept. 11, 1984.
J.F. Clarke: U.S. Patent No. 3513535, May 1970.
J.P. Hammond, S.A. David, and J.J. Woodhouse:Proc. 22nd Conf. Automotive Engineers, TMS-AIME, Warrendale, PA, 1985, pp. 523–29.
H. Mizuhara and K. Mally:Weld. J., 1985, vol. 64, pp. 27–32.
E.O. Ballard, E.A. Meyer, and G.M. Brennan:Weld. J., 1985, vol. 64, pp. 37–42.
H. Mizuhara and E. Huebel:Weld J., 1986, vol. 65, pp. 43–51.
A.J. Moorhead and H. Keating:Weld. J., 1986, vol. 65, pp. 17–31.
R. Standing and M. Nicholas:J. Mater. Sci., 1978, vol. 13, pp. 1509–14.
D.A. Canonico, N.C. Cole, and G.M. Slaughter:Weld. J., 1977, vol. 56, pp. 31–38.
S. Weiss and C.M. Adams:Weld. Res. Suppl., 1967, vol. 46, p. 50-s.
H. John and H. Hausner:Int. J. High Technol. Ceram., 1986, vol. 2, pp. 73–77.
Rakesh R. Kapoor and Thomas W. Eagar:J. Am. Ceram. Soc., March 1989, vol. 72, (3), pp. 448–53.
K. Suganuma, T. Okamoto, M. Koizumi, and M. Shimada:Comm. Am. Ceram. Soc. Lett., 1985, pp. 648–50.
K. Suganuma, T. Okamoto, M. Koizumi, and M. Shimada:J. Mater. Sci. Lett., 1985, pp. 648–50.
Thaddeus B. Massalski:Binary Alloy Phase Diagrams, ASM, Metals Park, OH, 1986, vols. 1. and 2.
Thomas B. Reed:Free Energy of Formation of Binary Compounds, An Atlas of Charts for High Temperature Chemical Reactions, MIT Press, Cambridge, MA, 1971.
A.R. Miedema, F.R. de Boer, and R. Boom:CALPHAD, 1977, vol. 1 (4), pp. 341–59.
Rakesh R. Kapoor and Thomas W. Eagar:Advances in Ceramics, in press.
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Kapoor, R.R., Eagar, T.W. Tin-based reactive solders for ceramic/metal joints. Metall Trans B 20, 919–924 (1989). https://doi.org/10.1007/BF02670197
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DOI: https://doi.org/10.1007/BF02670197