Abstract
TheS parameters of multi-vias in Multi-Chip Module(MCM) package are extracted by the Finite Difference Time Domain(FDTD) method combined with the Fourier transform and theory of network. The results demonstrate that excellent transmission properties are available at least below10GHz in Ceramic MCM(MCM-C) package and30GHz in Deposited MCM(MCM-D) package, and the transmission properties are not sensitive to the given distance between two proximate vias.
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This work was supported by the National Natural Science Fund of China and by the Fok Ying Tung Education Foundation.
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Zhong, M., Wang, BZ. Frequency domain transmission properties of multi-VIAS. Int J Infrared Milli Waves 18, 745–755 (1997). https://doi.org/10.1007/BF02678010
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DOI: https://doi.org/10.1007/BF02678010