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Thermal management of high heat flux nanoelectronic chips

  • Electronics Cooling/Microchannels And Minichannels
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Abstract

Driven by the continuing Moore’s Law evolution in chip technology, power dissipation of nanoelectronics chips could exceed 300W, with heat fluxes above 150W/cm2, within the next few years, along with localized, sub-millimeter zones with heat fluxes in excess of 1kW/cm2. New and novel cooling techniques, with the ability to selectively cool sub-millimeter “sun spots” while providing effective global cooling for high heat flux chips are needed. Several promising approaches, including the application of miniaturized silicon and BiTe thermoelectric coolers and direct cooling with dielectric liquids through thin film evaporation, will be described.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Maryland, 20742, College Park, MD

    Avram Bar-Cohen, Peng Wang & Emil Rahim

Authors
  1. Avram Bar-Cohen
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  2. Peng Wang
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  3. Emil Rahim
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Additional information

Keynote Lecture was presented on the Second International Topical Team Workshop on TWO-PHASE SYSTEMS FOR GROUND AND SPACE APPLICATIONS October 26–28, 2007, Kyoto, Japan.

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Bar-Cohen, A., Wang, P. & Rahim, E. Thermal management of high heat flux nanoelectronic chips. Microgravity Sci. Technol 19, 48–52 (2007). https://doi.org/10.1007/BF02915748

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  • DOI: https://doi.org/10.1007/BF02915748

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