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Gold in electronic components

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Abstract

The Electronic Components Conferences of the Institute of Electrical and Electronic Engineers constitute a forum for discussion of all aspects of modern electronic components: basic phenomena, device and materials characteristics, interconnections and manufacturing technologies. A recurring theme in San Diego, from 10th to 12th May, 1982, attention was focussed on conservation of gold in connectors, and in bonded and soldered interconnections. This review highlights significant developments in this area.

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Reference

  • ‘Proceedings of the 32nd Electronic Components Conference’ San Diego, CA., May 10–12, 1982, Institute of Electrical and Electronic Engineers, New York, Cat. No. 82CH1781-4

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Authors and Affiliations

  1. Bell Laboratories, Columbus, OH., USA

    Morton Antler

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  1. Morton Antler
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Antler, M. Gold in electronic components. Gold Bull 16, 2–7 (1983). https://doi.org/10.1007/BF03216570

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  • DOI: https://doi.org/10.1007/BF03216570

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