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Investigation of the effect of diffusion bonding parameters on microstructure and mechanical properties of 7075 aluminium alloy

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Abstract

In the present study, diffusion bonding of aluminium alloy (AA7075) sheet materials which are used especially in the automobile and aerospace industry has been investigated at temperatures of 425 and 450 °C and pressures of 2 and 3 MPa for 180 min in argon atmosphere. The microstructural and mechanical properties of bonding have been characterized with different welding parameters such as bonding temperature and pressure. The microstructure was characterized by light optical microscope, scanning electron microscope and energy dispersive spectroscopy, while the mechanical properties were determined by tensile-shear tests and microhardness tests. The results obtained are discussed from both the microstructural and mechanical points of view. It was observed in the microstructural investigations that the interfacial oxide layer decreased with increasing of the bonding temperature and pressure. The maximum shear strength was found to be 131 MPa for the Al 7075 sample bonded at 450 °C and 3 MPa for 180 min. It is shown that in certain extent, the bonding temperature and bonding pressure have great effect on the joint shear strength. With the increasing of bonding temperature and pressure, the shear strength of the joints increases due to diffusion of atoms in the interface. The strength achieved after bonding were dependent on interface grain boundary migration and on grain growth during the bonding process. The maximum hardness value of the Al 7075 sample bonded at 450 °C, 3 MPa for 180 min is 92.5 HV0.2. Increasing hardness with increasing temperature can be attributed to the formation of metallic bond at high temperatures and pressures.

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  1. Engineering Faculty, Karabuk University, Karabuk, Turkey

    Naci Kurgan

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  1. Naci Kurgan
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Kurgan, N. Investigation of the effect of diffusion bonding parameters on microstructure and mechanical properties of 7075 aluminium alloy. Int J Adv Manuf Technol 71, 2115–2124 (2014). https://doi.org/10.1007/s00170-014-5650-9

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  • DOI: https://doi.org/10.1007/s00170-014-5650-9

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