Abstract
High-k gate dielectric hafnium dioxide films were grown on Si (100) substrate by pulsed laser deposition at room temperature. The as-deposited films were amorphous and that were monoclinic and orthorhombic after annealed at 500°C in air and N2 atmosphere, respectively. After annealed, the accumulation capacitance values increase rapidly and the flat-band voltage shifts from −1.34 V to 0.449 V due to the generation of negative charges via post-annealing. The dielectric constant is in the range of 8–40 depending on the microstructure. The I–V curve indicates that the films possess of a promising low leakage current density of 4.2×10−8 A/cm2 at the applied voltage of −1.5 V.
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I. Pallecchi, G. Grassano, D. Marre, M. Putti, A.S. Siri, Appl. Phys. Lett. 78, 2244 (2001)
Semiconductor Industry Association, International Technology Roadmap for Semiconductor, 2006 Edition (http://public.itrs.net)
S.H. Lo, D.A. Buchanan, Y. Taur, W. Wang, IEEE Electron Device Lett. 18, 209 (1997)
S. Dhar, M.S.R. Rao, S.B. Ogale, D.C. Kundaliya, S.R. Shinde, T. Venkatesan, Appl. Phys. Lett. 87, 241504 (2005)
G.D. Wilk, R.M. Wallace, J.M. Anthony, J. Appl. Phys. 89, 5243 (2001)
J. Roberson, J. Non-Cryst. Solids 303, 94 (2002)
O. Buiu, Y. Lu, I.Z. Mitrovic, S. Hall, P. Chalker, R.J. Potter, Thin Solid Films 515, 623 (2006)
X. Liu, D. Li, Appl. Surf. Sci. 253, 2143 (2006)
L. Pereira, P. Barquinha, E. Fortunnato, R. Martins, Mater. Sci. Semicond. Process. 9, 1125 (2006)
Z. He, W. Wu, H. Xu, J. Zhang, Y. Tang, Vacuum 81, 211 (2006)
K. Yamamoto, S. Hayashi, M. Kubota, M. Niwa, Appl. Phys. Lett. 81, 2053 (2002)
J. Morais, L. Miotti, G.V. Soares, S.R. Teixeiira, R. Pezzi, K.P. Bastos, A.L.P. Rotondaro, J.J. Chambers, M.R. Visokay, Appl. Phys. Lett. 81, 2955 (2002)
T.J. Park, J.H. Kim, M.H. Seo, J.H. Jang, C.S. Hwang, Appl. Phys. Lett. 90, 152906 (2007)
M. Cho, J.H. Kim, C.S. Hwang, Appl. Phys. Lett. 90, 182907 (2007)
M.H. Cho, Y.S. Roh, C.N. Whang, K. Jeong, S.W. Nahm, D.H. Ko, J.H. Lee, N.J. Lee, K. Fujihara, Appl. Phys. Lett. 81, 472 (2002)
J. Wang, H. Li, R. Steven, J. Mater. Sci. 27, 5397 (1992)
S.W. Nam, J.H. Yoo, S. Nam, H.J. Choi, D.W. Lee, D.H. Ko, J.H. Moon, J.H. Ku, S.Y. Choi, J. Non-Cryst. Solids 303, 139 (2002)
G. He, L.Q. Zhu, M. Liu, Q. Fang, L.D. Zhang, Appl. Surf. Sci. 253, 3413 (2007)
Y.J. Cho, N.V. Nguyen, C.A. Richter, J.R. Ehrstein, B.H. Lee, L.C. Lee, Appl. Phys. Lett. 80, 1249 (2002)
K.J. Yang, C. Hu, IEEE Trans. Electron Devices 46, 1500 (1999)
H.F. Wolf, Semiconductor (Wiley, New York, 1971)
A.P. Huang, P.K. Chu, J. Appl. Phys. 97, 114106 (2005)
R. Puthenkvilakam, M. Sawkar, J.P. Chang, Appl. Phys. Lett. 86, 202902 (2005)
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Wang, H., Wang, Y., Feng, J. et al. Structure and electrical properties of HfO2 high-k films prepared by pulsed laser deposition on Si (100). Appl. Phys. A 93, 681–684 (2008). https://doi.org/10.1007/s00339-008-4695-8
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DOI: https://doi.org/10.1007/s00339-008-4695-8