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The behavior of a crack in functionally graded piezoelectric/piezomagnetic materials under anti-plane shear loading

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Summary

In this paper, the behavior of a crack in functionally graded piezoelectric/piezomagnetic materials subjected to an anti-plane shear loading is investigated. To make the analysis tractable, it is assumed that the material properties vary exponentially with the coordinate parallel to the crack. By using a Fourier transform, the problem can be solved with the help of a pair of dual integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. These equations are solved using the Schmidt method. The relations among the electric displacement, the magnetic flux and the stress field near the crack tips are obtained. Numerical examples are provided to show the effect of the functionally graded parameter on the stress intensity factors of the crack.

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Authors and Affiliations

  1. Center for Composite Materials, Harbin Institute of Technology, P.O. Box 1247, Harbin, 150001, P.R. China

    Z.-G. Zhou, L.-Z. Wu & B. Wang

Authors
  1. Z.-G. Zhou
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  2. L.-Z. Wu
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  3. B. Wang
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Correspondence to Z.-G. Zhou.

Additional information

The authors are grateful for financial support from the Natural Science Foundation of Hei Long Jiang Province (A0301), the National Natural Science Foundation of China (50232030, 10172030), the Natural Science Foundation with Excellent Young Investigators of Hei Long Jiang Province(JC04-08) and the National Science Foundation with Excellent Young Investigators (10325208).

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Zhou, ZG., Wu, LZ. & Wang, B. The behavior of a crack in functionally graded piezoelectric/piezomagnetic materials under anti-plane shear loading. Archive of Applied Mechanics 74, 526–535 (2005). https://doi.org/10.1007/s00419-004-0369-y

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  • DOI: https://doi.org/10.1007/s00419-004-0369-y

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