Abstract
Electrical routing and integrated packaging on bio-compatible flexible substrates have been designed and fabricated. The realized packaging method can integrate electrical circuits, stationary components and moving components on flexible substrates. Chips can be embedded on flexible packages and work on a non-planar surface. In this article, the package specimens are tested and simulated in tensile, bending and sealing experiments. In addition, the density and Young’s Modulus of polydimethylsiloxane (PDMS) is discussed with various curing conditions. A prototype made by the packaging process shows its functional system integration. This flexible packaging technology can be applied to communication or sensing products when flexibility is required.
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Chi-Yuan L, Guan-Wei W, Wei-Jung H (2008) Fabrication of micro sensors on a flexible substrate. Sens Actuators A 147:173–176. doi:10.1016/j.sna.2008.05.004
Christof L, Gerhard K, Gregor S, Rolf A (2001) New dicing and thinning concept improves mechanical reliability of ultra thin silicon. In: Proceedings of International Symposium on Advanced Packaging Materials, 92–97. doi:10.1109/ISAOM.2001.916555
Daniel JL, Aaron EH, Angus IK (2007) Flexible thin film temperature and strain sensor array utilizing a novel sensing concept. Sens Actuators A 135:593–597. doi:10.1016/j.sna.2006.07.019
Deniz A, Chang L, Narayan A (1999) Re-configurable fluid circuits by PDMS elastomer micromachining. In: Proceedings of 12th IEEE International Conference on Micro Electro Mechanical Systems, 222–227. doi:10.1109/MEMSYS.1999.746817
Eun-Soo H, Yong-Jun K, Byeong-Kwon J (2004) Flexible polysilicon sensor array modules using “etch-release” packaging scheme. Sens Actuators A 111:135–141. doi:10.1016/j.sna.2003.10.022
Fukang J, Yu-Chong T, Ken W, Tom T, Gwo-Bin L, Chih-Ming H (1997) A flexible MEMS technology and its first application to shear stress sensor skin. In: Proceedings of IEEE 10th Annual International Workshop on Micro Electro Mechanical Systems, 465–470. doi:10.1109/MEMSYS.1997.581894
Gloria YY, Vasudev JB, Yu-Hsin W, Gisela L, William CT, Joyce HK (2004) Fabrication and characterization of microscale sensors for bone surface strain measurement. In: Proceedings of IEEE on Sensing, 1355–1358. doi:10.1109/ICSENS.2004.1426435
Kyu-Ho S, Chang-Ryoul M, Tae-Hee L, Chang-Hyun L, Yong-Jun K (2005) Flexible wireless pressure sensor module. Sens Actuators A 123–124:30–35. doi:10.1016/j.sna.2005.01.008
Pi-Guey S, Chao-Shen W (2007) Novel flexible resistive-type humidity sensor. Sens Actuators B 123:1071–1076. doi:10.1016/j.snb.2006.11.015
Richardson RR Jr, Miller JA, Reichert WM (1993) Polyimides as biomaterials: preliminary biocompatibility testing. Biomaterials 14:627–635
Srinath S, Daniel TM, Arun M (2006) Parylene micro membrane capacitive sensor array for chemical and biological sensing. Sens Actuators B 115:494–502. doi:10.1016/j.snb.2005.10.013
Tayfun A, Khalil N, Richard HS, Robert MB (1994) A micromachined silicon sieve electrode for nerve regeneration applications. IEEE Trans Biomed Eng 41:305–313. doi:10.1109/10.284958
Wen-Rui L (2003) Development of a force sensing array system and its applications in cell-mechanics. Master’s thesis, National Cheng Kung University, Taiwan
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The authors gratefully acknowledge the support from the National Science Council of Taiwan, Republic of China (Contract NSC 95-2221-E-007-065-MY3).
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Hocheng, H., Chen, CM., Chou, YC. et al. Study of novel electrical routing and integrated packaging on bio-compatible flexible substrates. Microsyst Technol 16, 423–430 (2010). https://doi.org/10.1007/s00542-009-0930-2
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DOI: https://doi.org/10.1007/s00542-009-0930-2