Abstract
The design, fabrication and packaging process of silicon resonators capable of the integration of LSI (Large Scale Integration) have been developed on the basis of packaging technology using an LTCC (Low Temperature Co-fired Ceramic) substrate. The structures of silicon resonators are defined by deep reactive ion etching (DRIE) on a silicon on insulator (SOI) wafer and then transferred onto the LTCC substrate and hermetically sealed by anodic bonding technique. The measured resonant frequency of a micromechanical bulk acoustic mode silicon resonator after packaging at 0.02 Pa is 20.24 MHz with a quality factor of 50,600.
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Acknowledgments
Part of this work was performed in the Micro/Nanomachining research education center and the Nishizawa center of Tohoku University. This work was supported in part by a Grant-in Aid for Scientific Research from the Japanese Ministry of Education, Culture, Sports, Science and Technology of Japan, also supported in part by Special Coordination Funds for Promoting Science and Technology, Formation of Innovation Center for Fusion of Advanced Technologies.
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Van Toan, N., Miyashita, H., Toda, M. et al. Fabrication of an hermetically packaged silicon resonator on LTCC substrate. Microsyst Technol 19, 1165–1175 (2013). https://doi.org/10.1007/s00542-012-1716-5
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DOI: https://doi.org/10.1007/s00542-012-1716-5