Abstract
This paper presents a numerical investigation of the probabilistic approach in estimating the reliability of wire bonding, and develops a reliability-based design optimization Methodology (RBDO) for microelectronic device structures. The objective of the RBDO method is to design structures which should be both economical and reliable where the solution reduces the structural weight in uncritical regions. It does not only provide an improved design, but also a higher level of confidence in the design. The Finite element simulation model intends to analyze the sequence of the failure events in power microelectronic devices. This numerical model is used to estimate the probability of failure of power module regarding the wire bonding connection. However, due to time-consuming of the multiphysics finite element simulation, a response surface method is used to approximate the response output of the limit state, in this way the reliability analysis is performed directly to the response surface by using the First and the Second Order Reliability Methods FORM/SORM. Subsequently the reliability analysis is integrated in the optimization process to improve the performance and reliability of structural design of wire bonding. The sequential RBDO algorithm is used to solve this problem and to find the best structural designs which realize the best compromise between cost and safety.
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References
ANSYS Guide (2015) ANSYS Structural Analysis Guide
Aoues Y, Chateauneuf A (2010) Benchmark study of numerical methods for reliability-based design optimization. Struct Multidiscip Optim 41(2):277–294
Aoues Y, Makhloufi A, Pougnet P, El Hami A (2012) Probabilistic assessment of thermal fatigue of solder joints in mechatronic packaging. In: Proceedings of the 1st International Symposium on Uncertainty Quantification and Stochastic Modeling, Maresias, SP, Brazil
Aoues Y, Makhloufi A, El-Hami A (2015) Optimizing reliability of electronic systems. In: Embedded Mechatronic Systems 2. Elsevier, pp 181–215
Brotzen FR (1994) Mechanical testing of thin films. Int Mater Rev 39:4–25
Chen LY, Lin ST, Luo X (2004) Structure optimization of au wire wedge-bond for high temperature applications. In: International high temperature electronics conference and exhibition (HiTEC)
Elhami A, Radi B (2013) Uncertainty and optimization in structural mechanics. Wiley Online Library
Hammersley JM, Handscomb DC (1964) Monte Carlo methods. Wiley, New York
Holdorf R, Lemosse D, de Cursi ES, Rojas J, El Hami A (2011) An approach for the reliability based design optimization of laminated composites. Int J Eng Optim 43(10):1079–1094
Hunter GW, Neudeck PG, Okojie RS, Beheim GM, Kraskowski M, Ponchak GE, Chen L-Y (2007) High temperature electronics, communications, and supporting technologies for venus missions. In: 5th International Planetary Probe Workshop, IPPW-5, Bordeaux, France
Iman RL, Conover WJ (1980) Small sample sensitivity analysis techniques for computer models with an application to risk assessment. Commun Stat Part A Theory Methods A9(17):1749–1842
Kharmanda G, Olhoff N, El-Hami A (2004) Optimum safety factor approach for reliability based design optimization with extension to multiple limit state case. Struct Multidiscip Optim 27:421–434
Kharmanda G, Makhloufi A, Mohsine A, El Hami A (2008) Recent methodologies for reliability-based design optimization. Int J Simul Multidiscip Des Optim EDP Sci 2:11–24
Kim KS, Song JY, Chung EK, Park JK, Hong SH (2006) Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires. Mech Mater 38:119–127
Lemaire M, Chateauneuf A, Mitteau JC (2010) Structural reliability. Jacky Mazars Series Editor, Wiley Online Library
Liu DS, Chao YC, Wang CH (2004) Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method. Finite Elem Anal Des 40:263–286
Lu H, Bailey C, Yin C (2009) Design for reliability of power electronics modules. Microelectron Reliab 49:1250–1255
Makhloufi A, Aoues Y, El-Hami A (2015) Electro-thermo-mechanical modeling. In: Embedded Mechatronic Systems 2. Elsevier, pp 107–150
Micol A, Martin C, Dalverny O, Mermet-Guyennet M, Karama M (2009) Reliability of lead free solder in power module with stochastic uncertainty. Microelectron Reliab 49:631–641
Narayanan KR, Sridhar I, Subbiah S (2010) Effect of cold work on the mechanical response of drawn ultra-fine gold wire. Comput Mater Sci 49:S119–S125
Olhoff N, Taylor JE (1983) On structural optimization. J Appl Mech 50:1139-11
Pecht M, Lall P, Dasgupta A (1989) A failure prediction model for wire bonds. In: Proceedings of the 1989 International Symposium on Hybrid Micro., pp 607–613
Sauveplane JB, Tounsi P, Scheid E, Deram A (2008) 3D electro-thermal investigations for reliability of ultra low on state resistance power MOSFET. Microelectron Reliab 48:1464–1467
Shavezipur M, Ponnambalam K, Hashemi SM, Khajepour A (2008) A probabilistic design optimization for MEMS tunable capacitors. Microelectron J 39:1528–1533
Shi H, Fan S, Zhang Y, Sun J (2015) Design and optimization based on uncertainty analysis in electro-thermal excited MEMS resonant sensor. Microsyst Technol 21:757–771
Srikanth N, Wen YY, Lim CT, Kumar BS, Vath CJ, Kuah TH (2001) FEM based studies of ultra-ne pitch wire bond process. In: Proceedings of the APACK 2001 Conference on Advances in Packaging, Singapore
Tay AAO, Seah BC, Ong SH (1997) Finite element simulation of wire looping during wirebonding. In: Proceedings of the Advances in Electronic Packaging, ASME, New York
Tsompanakis Y, Lagaros ND, Papadrakakis M (2008) Structural design optimization considering uncerai-nties, Édition Taylor & Francis. Chapter 9, pp 217–246
Wong SM, Hobbs RE, Onof C (2005) An adaptive response surface method for reliability analysis of structures with multiple loading sequences. Struct Saf 27:287–308
Wu W, Held M, Jacob P, Scacco P, Birolini A (1995) Investigation on the long term reliability of power IGBT modules. In: IEEE Proceedings of 1995 International Symposium on Power Semiconductor Devices and Ics, No. 95CH35785, Yokohama, Japan, pp 443–448
Wunderle B, Becker K-F, Sinning R, Wittler O (2009) Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation. Microsyst Technol 15:1467–1478
Ye H, Lin M, Basaran C (2002) Failure modes and FEM analysis of power electronic packaging. Finite Elem Anal Des 38:601–612
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This effort was financed by the FIRST-MFP project (Fiabiliser et Renforcer des Systèmes Technologiques mécatroniques de forte puissance) one of the projects accepted by the Mov’eo French competitiveness cluster in automotive and public transport R&D.
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Makhloufi, A., Aoues, Y. & El Hami, A. Reliability based design optimization of wire bonding in power microelectronic devices. Microsyst Technol 22, 2737–2748 (2016). https://doi.org/10.1007/s00542-016-3151-5
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DOI: https://doi.org/10.1007/s00542-016-3151-5