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Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks

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Abstract

In this work we exploit a multi-scale framework to model the shock-induced failure of polysilicon micro electro-mechanical systems (MEMS), and study the impact of uncertainties at polycrystal length-scale on the results. Because of polysilicon brittleness, MEMS sensors almost instantaneously fail by micro-cracking when subjected to shocks. Since the length of the zone where such micro-cracking is spreading can amount to 5–10% of the characteristic grain size, the morphology of polysilicon films constituting the movable parts of the MEMS is explicitly modeled at the micro-scale within a cohesive approach. Focusing on shocks induced by accidental drops, forecasts of MEMS failure are obtained through a Monte Carlo methodology, wherein statistics of the polycrystalline morphology are accounted for. Outcomes, in terms of failure mode and drop height leading to failure, are shown to correctly represent available experimental evidences relevant to a commercial micro-device.

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Authors and Affiliations

  1. Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Piazza L. da Vinci 32, 20133, Milano, Italy

    Stefano Mariani, Roberto Martini, Aldo Ghisi & Alberto Corigliano

  2. MH Division, STMicroelectronics, Via Tolomeo 1, 20010, Cornaredo, Italy

    Barbara Simoni

Authors
  1. Stefano Mariani
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  2. Roberto Martini
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  3. Aldo Ghisi
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  4. Alberto Corigliano
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  5. Barbara Simoni
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Correspondence to Stefano Mariani.

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Mariani, S., Martini, R., Ghisi, A. et al. Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks. Int J Fract 167, 83–101 (2011). https://doi.org/10.1007/s10704-010-9531-4

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  • DOI: https://doi.org/10.1007/s10704-010-9531-4

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