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The application of thick-film technology in C-MEMS

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Abstract

Laminated 3D structures made using low-temperature co-fired ceramic (LTCC) technology are practical for ceramic micro-electro-mechanical systems (C-MEMS). The sensors for mechanical quantities, and/or actuators, are fundamental parts of MEMS. Thick-film resistors can be used to sense the mechanical deformations, and thick-film piezoelectric materials can be used as electro-mechanical transducers in a C-MEMS structure. The integration of these thick-film materials on LTCC substrates is in some cases difficult to realise due to interactions with the rather glassy LTCC substrates. The subject of our work is an investigation of thick-film materials for electro-mechanical transducers (sensors and actuators) and their compatibility with LTCC substrates. Resistors made with commercial thick-film resistor materials for use as sensors on LTCC substrates have been investigated and evaluated. Ferroelectric ceramic materials based on solid solutions of lead zirconate titanate (PZT) with low firing temperatures around 850°C were developed for thick-film technology and evaluated on LTCC substrates.

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Acknowledgements

The authors wish to thank Mr. Mitja Jerlah (HIPOT-RR) for printing and firing the samples as well as for measuring the electrical characteristics.

The financial support of the Slovenian Research Agency in the frame of the project L2-6462 and the EC support of the project MINUET (FP6-505657) and NoE MIND (FP6-515757) are gratefully acknowledged.

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Authors and Affiliations

  1. HIPOT-R&D and HYB, Trubarjeva 7, 8310, Sentjernej, Slovenia

    Darko Belavic, Marina Santo Zarnik & Marko Pavlin

  2. “Jožef Stefan” Institute, Jamova 39, 1000, Ljubljana, Slovenia

    Marko Hrovat, Janez Holc & Marija Kosec

Authors
  1. Darko Belavic
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  2. Marko Hrovat
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  3. Janez Holc
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  4. Marina Santo Zarnik
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  5. Marija Kosec
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  6. Marko Pavlin
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Correspondence to Darko Belavic.

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Belavic, D., Hrovat, M., Holc, J. et al. The application of thick-film technology in C-MEMS. J Electroceram 19, 363–368 (2007). https://doi.org/10.1007/s10832-007-9064-z

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  • DOI: https://doi.org/10.1007/s10832-007-9064-z

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