Abstract
The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5Tm even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn–Pb solder alloys. Some recent researches show that the room temperature aging has significant effects on mechanical properties of solders. This paper is intended to review all available data in the field and give rise to the possible factors including room temperature effects which causes the large discrepancies of data. This review of the research literatures has documented the dramatic changes that occur in the constitutive and failure behavior of solder materials and solder joint interfaces during isothermal aging. However, these effects have been largely ignored in most previous studies involving solder material characterization or finite element predictions of solder joint reliability during thermal cycling. It is widely acknowledged that the large discrepancies in measured solder mechanical properties from one study to another arise due to differences in the microstructures of the tested samples. This problem is exacerbated by the aging issue, as it is clear that the microstructure and material behavior of the samples used in even a single investigation are moving targets that change rapidly even at room temperature. Furthermore, the effects of aging on solder behavior must be better understood so that more accurate viscoplastic constitutive equations can be developed for SnPb and SAC solders. Without such well-defined relationship, it is doubtful that finite element reliability predictions can ever reach their full potential.
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References
Allenby BR, Ciccarelli JP (1992) In: Proceeding of surface mount international conference, pp 1–28
Turbini LJ (2001) IEEE Trans Electron Pack Manuf 24(1):4
Hwang JS (2004) Implementing lead-free electronics. McGraw-Hill, New York, NY, p 1
Grusd A (1999) In: Proceedings of the technical program NEPCON west, pp 212–221
IPC Roadmap (2000) A guide for assembly of lead-free electronics. IPC, Northbrook, IL
Abtew M, Selvaduray G (2000) Mater Sci Eng 27:95
Zeng K, Tu KN (2002) Mater Sci Eng 38:55
Karlya Y, Gagg C, Plumbridge WJ (2000) Solder Surf Mt Technol 13:39
Lee NC (1997) Solder Surf Mt Technol 26:65
Soldertec (2002) European lead-free roadmap, ver 1, p 1
Deubzer O, Hamano H, Suga T (2001) In: Proceedings of the 2001 IEEE international symposium on electronics and the environment, pp 290–295
Nimmo K (2004) In: Suganuma K (ed) Alloy selection, chapter 3 of lead-free soldering in electronics: science, technology and environmental impact. Marcel Dekker, New York, p 61
Ye L, Lai ZH, Liu J, Thölén A (2001) Solder Surf Mt Technol 13:16
Iting T, Li JT, Yen SF, Chuang TH, Lo R, Ku T, Wu E (2005) In: Proceedings of the 55th electronic components and technology conference, pp 687–691
Fields RJ, Low SR. Physical and mechanical properties of intermetallic compounds commonly found in solder joints. Available online at: https://doi.org/www.metallurgy.nist.gov/mechanical_properties/solder_paper.html
Ganesan S, Pecht M (2006) Lead-free electronics. Wiley-Interscience Publication, New York, p 51
Hwang J (2001) Environment-friendly electronics: lead free technology. Electrochemical Publications, British Isles, p 134
Hertzberg RW (1996) Deformation and fracture mechanics of engineering materials, 4th edn. Wiley, New York
Thornton PA, Colangelo VJ (1985) Fundamentals of engineering materials. Prentice-Hall, Inc, Upper Saddle River, NJ, p 227
Gilman JJ (1969) Micromechanics of flow in solids. McGraw-Hill, New York
Ralls KM, Courtney TH, Wulff J (1976) Introduction to materials science and engineering. Wiley, New York
Vianco PT (2006) In: Shangguan D (ed) Fatigue and creep of lead-free solder alloys: fundamental properties, chapter 3 lead-free solder interconnect reliability. ASM International, Materials Park, OH, p 67
Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meusel E, Michel B (2001) In: Proceeding of the 51st electronic components and technology conference, pp 890–902
McCabe RJ, Fine ME (1998) Scripta Mater 39(2):189
Lau JH, Pao YH (1997) Solder joints reliability of BGA, CSP, Flip-Chip, and Fine Pitch SMT assemblies. McGraw-Hill, New York
Cadek J (1988) Creep in metallic materials. Elsevier, Amsterdam
Garofalo F (1966) Fundamentals of creep and creep-rupture in metals. Macmillan, New York
Evans RW, Wilshire B (1985) Creep of metals and alloys. The Institute of Metals, New York
Ashby MF (1972) Acta Metall 20:887
Weertman J (1957) J Appl Phys 28:362
Coble RL (1963) J Appl Phys 34:1679
Nabarro FRN (1948) Report of a conference on the strength of solids. Physical Society, London, pp 75–81
Herring C (1950) J Appl Phys 21:437
Shi XQ, Wang ZP, Yang QJ, Pang HLJ (2003) J Eng Mater Technol 125:81
Mukherjee AK, Bird JE, Dorn JE (1969) Trans Am Soc Metal 62:155
Puttlitz KJ, Stalter KA (2004) Handbook of lead-free solder technology for microelectronic assemblies. Marcel Dekker, New York
Nose H, Sakane M, Tsukada Y, Nishimura H (2003) J Electron Packaging 125(1):59
McCormack M, Chen HS, Jin S (1994) Appl Phys Lett 65(10):1233
Shi XQ, Zhou W, Pang HLJ, Wang ZP (1999) J Electron Packaging 121(3):179
Pang JHL, Xiong BS, Neo CC, Zhang XR, Low TH (2003) In: Proceeding of the 53rd electronic components and technology conference, pp 673–679
Pang JHL, Xiong BS, Low TH (2004) Thin Solid Films 462–463:408
Yeung B, Jang JW (2002) J Mater Sci Lett 21:723
Kim KS, Huh SH, Suganuma K (2002) Mater Sci Eng A 333:106
Madeni JC, Liu S, Siewert T (2002) In: Proceedings of the ASM international conference
Lin JK, De Silva A, Frear D, Guo Y, Hayes S, Jang JW, Li L, Mitchell D, Yeung B, Zhang C (2002) IEEE Trans Electron Pack Manuf 25(4):300
Chuang CM, Liu TS, Chen LH (2002) J Mater Sci 37(1):191. doi:https://doi.org/10.1023/A:1013143218738
Vianco PT, Rejent JA, Grant R (2004) Trans Jpn Inst Metall 45:765
Xiao Q, Nguyen L, Armstrong WD (2004) In: Proceedings of the 54th electronic components and technology conference, pp 1325–1332
Xiao Q, Bailey HJ, Armstrong WD (2004) J Electron Packaging 126(2):208
Shohji I, Yoshida T, Takahashi T, Hioki S (2004) Mater Sci Eng A366:50
Tsukada Y, Nishimura H, Yamamoto H, Sakane M (2005) J Electron Packaging 127(4):407
Yang H, Phillip D, Paul M, Murty KL (1996) In: Proceeding of 46th electronic components and technology conference, pp 1136–1142
Liu CY, Chen C, Mal AK, Tu KN (1999) J Appl Phys 85(7):3882
Rhee H, Subramanian KN, Lee A, Lee JG (2003) Sold Surf Mt Technol 15(3):21
Pang JHL, Low TH, Xiong BS, Xu L, Neo CC (2004) Thin Solid Films 462–463:370
Darveaux R (2005) In: Proceedings of the 55th electronic components and technology conference, pp 882–893
Obaid AA, Sloan JG, Lamontia MA, Paesano A, Khan S, Gillespie JW (2005) J Electron Packaging 127(4):483
Zhang Q, Dasgupta A, Nelson D, Pallavicini H (2005) J Electron Packaging 127(4):415
Chromik RR, Vinci RP, Allen SL, Notis MR (2003) JOM 55(6):66
Vianco PT, Rejent JA, Martin JJ (2003) JOM 55(6):50
Vianco PT, Rejent JA (2002) Compression deformation response of 95.5Sn–3.9Ag–0.6Cu solder, UCLA Workshop on Pb-free Electronics, 2002. Available at: https://doi.org/www.seas.ucla.edu/eThinFilm/PbfreeWorkshop/pdf/vianco.pdf
Vianco PT, Rejent JA, Kilgo AC (2003) J Electron Mater 32(3):142
Schubert A, Walter H, Dudek R, Michel B, Lefranc G, Otto J, Mitic G (2001) In: International symposium on advanced packaging materials, pp 129–134
Biglari MH, Oddy M, Oud MA, Davis P (2000) In: Proceeding of electronics goes green 2000+ conference, pp 73–82
Lau JH, Pao Y-H (1997) Solder joint reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT assemblies. McGraw-Hill, New York
Darveaux R, Banerji K, Mawer A, Dody G (1995) In: Lau JL (ed) Ball grid array technology. McGraw-Hill, New York, p 379
Lau JH, Chang C (1998) In: Proceeding of the 48th electronic component and technology conference, pp 1339–1344
Pang JHL, Xiong BS (2005) IEEE Trans Compon Pack Technol 28(4):830
Kanchanomai C, Miyashita Y, Mutoh Y (2002) J Electron Mater 31:456
Kim KS, Huh SH, Suganuma K (2002) Mater Sci Eng A 333:106
Amagai M, Watanabe M, Omiya M, Kishimoto K, Shibuya T (2002) Microelectron Reliab 42:951
Kariya Y, Plumbridge J (2001) In: 7th symposium on microjoining and assembly in electronics, pp 383–388
Shohji I, Yoshida T, Takahashi T, Hioki S (2004) Mater Sci Eng A A366:50
Medvedev AS (1956) Metallovedenie i Obrabotka Metallov 7:16
Lampe BT (1976) Weld J 55(10):330s
Miyazawa Y, Ariga T (1999) In: Proceedings of the first international symposium on environmentally conscious design and inverse manufacturing, pp 616–619
Miyazawa Y, Ariga T (2001) Mater Trans Jpn Inst Metals 42(5):776
Chilton AC, Whitmore MA, Hampshire WB (1989) Sold Surf Mt Technol 3:21
Gagliano RA, Fine ME, Vaynman S, Stolkarts V (1999) In: Julia R (ed) Advanced materials for the 21st century: proceedings of the 1999. Weertman Symposium, pp 107–116
Coyle RJ, Solan PP, Serafino AJ, Gahr SA (2000) In: Proceedings of the 50th electronic components and technology conference, pp 160–169
Tsui YK, Lee SW, Huang X (2002) In: Proceedings of the 4th international symposium on electronic materials and packaging, pp 478–481
Lee SWR, Tsui YK, Huang X, Yan CC (2002) In: Proceedings of the 2002 ASME international mechanical engineering congress and exposition, pp 1–4
Hasegawa K, Noudou T, Takahashi A, Nakaso A (2001) In: Proceedings of the 2001 SMTA international, pp 1–8
Li M, Lee KY, Olsen DR, Chen WT, Tan BTC, Mhaisalkar S (2002) IEEE Trans Electron Pack 25(3):185
Chou GJS (2002) In: Proceedings of the 8th symposium on advanced packaging materials, pp 39–46
Law CMT, Wu CML (2004) In: Proceedings of HDP’04, pp 60–65
Wang Q, Johnson RW, Ma H, Gale WF (2005) In: 10th electronic circuit and world convention conference (ECWC 10)
Ding Y, Wang C, Li M, Bang HS (2004) Mater Sci Eng A384:314
Ma H, Suhling JC, Lall P, Bozack MJ (2006) In: Proceeding of the 56th electronic components and technology conference (ECTC), San Diego, CA, May 30–June 2, pp 849–864
Hall EO (1951) In: Proceedings of the physical society, vol 64, pp 747–753
Petch NJ (1953) J Iron Steel Inst 174:25
Lin J-K, Jang J-W, Hayes S, Frear D (2004) In: Proceeding of the 54th electronics packaging technology conference, pp 642–649
Wiese S, Meusel E, Wolter K-J (2003) In: Proceeding of the 53rd electronics packaging technology conference, pp 197–206
Banerji K, Darveaux R (1992) In: Proceeding of TMS-AIME symposium, pp 431–442
Sasaki K, Kobayashi T (2005) In: Proceeding of the ASME InterPACK’05
Ma H, Suhling JC, Lall P, Bozack MJ (2007) In: The proceeding of the 57th electronic components and technology conference (ECTC), pp 653–668
Jones WK, Liu Y, Zampino MA, Gonzalez G, Shah M (1997) Design and reliability of solders and solder interconnections, TMS
Jones WK, Liu Y, Zampino MA, Gonzalez G (1997) Adv Microelectron 24:30
Pang HLJ, Wang YP, Shi XQ, Wang ZP (1998) In: IEEE/CPMT electronics packaging technology conference, pp 184–189
Nose H, Sakane M, Tsukada T, Nishimura H (2003) J Electron Packaging 124:59
Plumbridge WJ, Gagg CR (1999) J Mater Sci: Mater Electron 10:461
Lang R, Tanaka H, Munegata O, Taguchi T, Narita T (2005) Mater Charact 54:223
Dai LH, Lee SR (2001) In: Proceeding of the ASME InterPACK’05, pp 307–313
Clech JP. Review and analysis of lead-free materials properties, NIST, Available at: https://doi.org/www.metallurgy.nist.gov/solder/clech/Sn-Ag-Cu_Main.htm
Anand L (1985) Int J Plasticity 1:213
Pei M, Qu J (2005) In: International symposium on advanced packaging materials: processes, properties and interfaces, pp 45–49
Pang JHL, Low PTH, Xiong BS (2004) In: Proceeding of ITHERM’04, vol 2, pp 131–136
Rodgers B, Flood B, Punch J, Waldron F (2005) In: Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, pp 490–496
Xu L, Pang JHL (2005) In: Proceeding of the 55th electronics packaging technology conference, pp 357–362
Fouassier O, Heintz J-M, Chazelas J, Geffroy P-M, Silvaina J-F (2006) J Appl Phys 100:1
Li D, Liu C, Conway P (2004) In: Proceeding of the 54th electronic components and technology conference, pp 128–133
Harrison MR, Vincent JH, Steen HAH (2001) Solder Surf Mt Technol 13(3):21
Rhee H, Lucas JP, Subramanian KN (2002) J Mater Sci: Mater Electron 13:477
Allen SL, Notis MR, Chromik RR, Vinci RP (2004) J Mater Res 19:1417
Allen SL, Notis MR, Chromik RR, Vinci RP, Lewis DJ, Schaefer R (2004) J Mater Res 19:1425
Xiao L, Liu J, Lai A, Ye L, Tholen A (2000) In: International symposium on advanced packaging materials, pp 145–151
Zhu F, Wang Z, Guan R, Zhang H (2005) In: 2005 international conference on asian green electronics, pp 107–112
Madeni J, Liu S, Siewert T. Casting of lead-free solder bulk specimens with various solidification rates, NIST Pb-free data. Available at: https://doi.org/www.boulder.nist.gov/
Seelig K, Suraski D (2000) In: Proceeding of the 50th electronic components and technology conference, pp 1405–1409
Lead-free soldering guide from AIM Solder Inc (2003) https://doi.org/www.psma.com/ul_files/forums/leadfree/aim_lead_free_guide.pdf
Enke NF, Kilinski TJ, Schroeder SA, Lesniak JR (1989) IEEE Trans Compon Hybrids Manuf Technol 12(4):459
Technical reports for the lead free solder project: properties reports: room temperature tensile properties of lead-free solder alloys. Lead free solder project CD-ROM, National Center for Manufacturing Sciences (NCMS), 1998. Available at: https://doi.org/www.boulder.nist.gov/
Lau JH, Chang C, Lee SWR, Chen TY, Cheng D, Tseng TJ, Lin, D (2000) In: Proceeding of NEPCON-west 2000, pp 554–562
Wong T, Matsunaga AH (1995) In: Proceeding of NEPCON west conference, 1995. Available at: https://doi.org/www.boulder.nist.gov/
Sigelko JD, Subramanian KN (2000) Adv Mater Process 157(3):47
Welco Castings, Solder Data Sheet, 2 Hillyard Street, Hamilton, Ontario, Canada. Available at: https://doi.org/www.boulder.nist.gov/
Hernandez CL, Vianco PT, Rejent JA (1998) Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints. IPC/SMTA Electronics Assembly Expo, pp S19-2-1. Available at: https://doi.org/www.boulder.nist.gov/
Darveaux R, Banerji K (1992) IEEE Trans Compon Hybrids Manuf Technol 15(6):1013
Xiao Q, Armstrong WD (2005) J Electron Mater 34(2):196
Zhang Q, Dasgupta A, Haswell P (2003) In: Proceeding of the 53rd electronic components and technology conference, pp 1862–1868
Lau J, Dauksher W, Vianco P (2003) In: Proceeding of the 53rd electronic components and technology conference, pp 229–236
Pang JHL, Xiong BS, Low TH (2004) In: Proceeding of 54th electronic components and technology conference, pp 1333–1337
Schubert A, Dudek R, Auerswald E, Gollbardt A, Michel B, Reichl H (2003) In: Proceeding of the 53rd electronic components and technology conference, pp 603–610
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Ma, H., Suhling, J.C. A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci 44, 1141–1158 (2009). https://doi.org/10.1007/s10853-008-3125-9
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DOI: https://doi.org/10.1007/s10853-008-3125-9