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Reliability behavior of lead-free solder joints in electronic components

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Abstract

With more consumer products moving towards environmentally friendly packaging, making solder Pb-free has become an urgent task for electronics assemblies. Solder joints are responsible for both electrical and mechanical connections. Solder joint does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Materials behavior of solder joints involves a creep–fatigue interaction, making it a poor material for mechanical connections. The reliability of solder joints of electronics components has been found playing a more important role in service for microelectronics components and micro-electro-mechanical systems. So many researchers in the world investigated reliability of solder joints based on finite element simulation and experiments about the electronics devices, such as CR, QFP, QFN, PLCC, BGA, CSP, FCBGA and CCGA, which were reviewed systematically and extensively. Synchronously the investigation on reliability of solder joints was improved further with the high-speed development of lead-free electronic packaging, especially the constitutive equations and the fatigue life prediction equations. In this paper, the application and research status of constitutive equations and fatigue life prediction equations were reviewed, which provide theoretic guide for the reliability of lead-free solder joints.

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Acknowledgments

The present work was carried out with the supported by the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation (JSAWS-11-03) and the Xuzhou Normal University Foundation (11XLR16).

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  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang, Ji-guang Han, Cheng-wen He & Yong-huan Guo

  2. Provincial Key Laboratory of Advanced Welding, Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Liang Zhang

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  2. Ji-guang Han
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Zhang, L., Han, Jg., He, Cw. et al. Reliability behavior of lead-free solder joints in electronic components. J Mater Sci: Mater Electron 24, 172–190 (2013). https://doi.org/10.1007/s10854-012-0720-y

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