Abstract
Wide energy gap semiconductors are broadly recognized as promising materials for novel electronic and opto-electronic device applications. As informed device design requires a firm grasp on the material properties of the underlying electronic materials, the electron transport that occurs within the wide energy gap semiconductors has been the focus of considerable study over the years. In an effort to provide some perspective on this rapidly evolving and burgeoning field of research, we review analyzes of the electron transport within some wide energy gap semiconductors of current interest in this paper. In order to narrow the scope of this review, we will primarily focus on the electron transport that occurs within the wurtzite and zinc-blende phases of gallium nitride and indium nitride in this review, these materials being of great current interest to the wide energy gap semiconductor community; indium nitride, while not a wide energy gap semiconductor in of itself, is included as it is often alloyed with other wide energy gap semiconductors, the resultant alloy often being a wide energy gap semiconductor itself. The electron transport that occurs within zinc-blende gallium arsenide will also be considered, albeit primarily for bench-marking purposes. Most of our discussion will focus on results obtained from our ensemble semi-classical three-valley Monte Carlo simulations of the electron transport within these materials, our results conforming with state-of-the-art wide energy gap semiconductor orthodoxy. A brief tutorial on the Monte Carlo electron transport simulation approach, this approach being used to generate the results presented herein, will also be provided. Steady-state and transient electron transport results are presented. The evolution of the field, a survey of the current literature, and some applications for the results presented herein, will also be featured. We conclude our review by presenting some recent developments on the electron transport within these materials. This review is the latest in a series of reviews that have been published on the electron transport processes that occur within the class of wide energy semiconductor materials. The results and references have been updated to include the latest developments in this rapidly evolving field of study.
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Notes
The fact that the energy gaps associated with some ternary and quaternary alloys within the III–V nitride semiconductor group are direct and continuously tunable over this wide swath of the electromagnetic spectrum, allows, within the context of a single family of materials, for the design of opto-electronic devices that can work over this range of frequencies. More traditional semiconductor technologies, such as those based on Si and GaAs, tend to service more narrow regions of the spectrum, and thus, offer less options for opto-electronic device design.
While the wurtzite phases of GaN and InN are the most common forms of these materials, zinc-blende forms of GaN and InN may also be grown [144,145,146,147,148,149,150,151,152,153]. It is now widely recognized that the zinc-blende phases of GaN and InN offer certain advantages over their wurtzite counterparts. Further details on this matter are provided later on in Sect. 4.
As will be discussed later, the Monte Carlo electron transport simulation approach arrives at a solution to the Boltzmann transport equation through the use of a simulation. While the Boltzmann transport equation characterizes the electron transport through a continuum treatment of the electron ensemble, the Monte Carlo simulation approach instead provides for a corpuscular solution to the Boltzmann transport equation. If the number of electrons considered in a given Monte Carlo electron transport simulation is sufficiently large, the solutions acquired from such a simulation will approach those determined through a direct continuum solution to the Boltzmann transport equation.
Structurally, these reviews are quite similar, different materials and conditions being considered, of course.
Once all of the transients have been fully extinguished, the electron ensemble will have shifted into a new equilibrium state. By an equilibrium state, however, we are not necessarily referring to thermal equilibrium, thermal equilibrium only being achieved in the absence of an applied electric field.
By electron drift velocity, we are referring to the average electron velocity, determined by statistically averaging over the entire electron ensemble.
The ensemble Monte Carlo approach to simulating the electron transport within semiconductors has been employed by many authors. A Monte Carlo electron transport simulation resource, with source code included, may be found at https://nanohub.org/resources/moca. Further information about the Monte Carlo approach itself, beyond that found within the electron transport simulation context, may also be found at http://www.codeproject.com/Articles/767997/Parallelised-Monte-Carlo-Algorithms-sharp and http://www.codeproject.com/Articles/32654/Monte-Carlo-Simulation?q=Monte+Carlo+code
The longitudinal and transverse sound velocities are equal to
$$\begin{aligned} \sqrt{\frac{C_{l}}{\rho }} \text { and } \sqrt{\frac{C_{t}}{\rho }}, \end{aligned}$$respectively, where \(C_{l}\) and \(C_{t}\) denote the respective elastic constants and \(\rho\) represents the mass density.
Piezoelectric scattering is treated using the well established zinc-blende scattering rates, and thus, for the cases of the wurtzite crystal structure, a suitably transformed piezoelectric constant, \(\text {e}_{14}\), must be selected. This may be achieved through the transformation suggested by Bykhovski et al. [168, 169]. The \(\text {e}_{14}\) value selected for wurtzite GaN is that suggested by Chin et al. [103]. The \(\text {e}_{14}\) values selected for the other materials considered in this analysis are set to that corresponding to wurtzite GaN.
All inter-valley deformation potentials are set to \(10^{9}\) eV/cm, following the approach of Gelmont et al. [102].
Each conduction band band structure is modeled as possessing three distinct “valleys,” each of the valley minima (with respect to energy) corresponding to a minima in the corresponding actual conduction band structure. The valley locations are specified according to the locations of the local energy minima in the band structures, the degeneracy of each valley, the effective mass of the electrons at each valley minimum, and the non-parabolicity coefficient corresponding to each valley also being specified.
For the case of direct-gap semiconductors, the \(E_{o}\) energy gap coincides with the regular energy gap, \(E_{g}\). For the case of indirect-gap semiconductors, however, the \(E_{o}\) energy gap exceeds \(E_{g}\). Adachi [172] refers to the \(E_{o}\) energy gap as the lowest direct-gap energy gap.
The wide energy gap semiconductors that are available today include those based on the III–V nitrides, ZnO, silicon carbide (SiC), and a variety of other wide energy gap semiconductors. The list of references included here include devices based on this broader class of materials.
Using a one-dimensional band structural evaluation for the effective mass of the electrons described using the Kane model, i.e., Eq. (2), Siddiqua et al. [154] demonstrated the important role that the non-parabolicity plays in influencing the effective mass of the electrons in a valley. The non-parabolicity associated with the lowest energy valley of the conduction band of zinc-blende InN is significantly greater than that associated with the other materials considered in this analysis, and hence, the nature of the electron transport is expected to be quite distinct. Further details are discussed by Siddiqua et al. [154].
Yoder [204] defines a wide energy gap semiconductor as being that possessing an energy gap equal to 2.2 eV or wider.
The earliest recorded studies into the material properties of the III–V nitride semiconductors, GaN, AlN, and InN, were performed in the 1920s, 1930s, and 1940s [50,51,52,53,54,55]. Unfortunately, the materials available at the time, small crystals and powders [3], were of poor quality. Thus, the III–V nitride semiconductor group remained of widely recognized but unrealized potential for many years. Indeed, it was only with the advent of modern deposition approaches, such as molecular beam epitaxy and metal-organic chemical vapor deposition, that the material quality exhibited by these materials approached the levels demanded of device applications. For the specific case of GaN, for example, improvements in the deposition process only started in the late 1960s; in 1969, Maruska and Tietjen [219] employed chemical vapor deposition in order to fabricate GaN. Since then, dramatic improvements in the material quality of the III–V nitride semiconductors, GaN, AlN, and InN, have been achieved. As a result, interest into the III–V nitride semiconductors, GaN, AlN, and InN, experienced a renaissance; this intense renewed interest into the III–V nitride semiconductors began in earnest in the early 1990s [3]. The work that arose as a consequence of this renewed interest is responsible for the genesis of the III–V nitride semiconductor industry that exists today. At present, GaN, AlN, and InN-based electronic and opto-electronic devices are widely available, such devices being used for a variety of commercial, industrial, and military applications [188, 220, 221].
Studies into the material properties of ZnO also found their genesis in the 1920s and 1930s [222,223,224]. SiC already had a significant following by that time, it being a ubiquitous material in the production of steel by the earliest parts of the 20th Century [225, 226]. Later, by the 1930s, it was recognized as a material of interest in its own right [227, 228]. Other wide energy gap semiconductors were introduced over the span of the 20th Century.
In principle, SiC can crystallize in the form of an infinite number of polytypes. Thus far, over 250 polytypes of SiC have actually been experimentally observed [229].
The more common polytypes of SiC possess wide and indirect energy gaps that range between 2.2 and 3 eV [4, 253, 254]. SiC is also found to exhibit a high breakdown field strength [255, 256], an elevated thermal conductivity [257, 258], and favorable electron transport characteristics [259]. This constellation of material properties associated with the various polytypes of SiC, and the recognition of the device opportunities thus engendered, were, in large measure, responsible for igniting interest into this material in the first place.
Initial interest in the device applications of the III–V nitride semiconductors focused on GaN, the wurtzite phase of this material exhibiting a wide and direct energy gap of around 3.39 eV [219]. Wurtzite GaN also exhibits a high breakdown field strength [282, 283], elevated thermal conductivity [284, 285], and superb electron transport characteristics [120, 121, 125, 129]. These attributes make GaN ideally suited for both electronic and opto-electronic device applications [286,287,288,289,290,291,292,293,294,295,296,297,298,299,300,301].
ZnO, while currently finding applications as a material for low-field thin-film transistor electron device structures [303] and as a potential material for transparent conducting electrodes [304], also possesses a direct energy gap [81, 305] with a magnitude that is very similar to that exhibited by GaN [306]. Thus, it might be expected that, with some further improvements in its material quality, ZnO may also be employed for some of the device roles currently implemented or envisaged for GaN.
While every effort was made to provide a reasonable sampling of the electron transport literature corresponding to each material, some key references may have been neglected. We apologize to authors for these potential oversights.
In 1986, Tansley and Foley [356] measured the spectral dependence of the optical absorption coefficient associated with wurtzite InN and determined that the energy gap associated with this material is around 1.89 eV. This value became the de facto standard for the field until 2002, when Wu et al. [260] demonstrated, using higher quality forms of wurtzite InN, that the energy gap associated with this material is actually around 0.7 eV. Other experimental measurements confirmed the narrower energy gap value suggested by Wu et al. [260, 357, 358]. This revised value for the wurtzite InN energy gap is now widely accepted by the semiconductor materials community.
Thermodynamic arguments have demonstrated that wurtzite is GaN’s stable phase [381]. It is now widely recognized, however, that the zinc-blende phase of this material, which can be prepared through the careful deposition of GaN onto an appropriately selected cubic substrate, offers a number of distinct advantages over its wurtzite form. In particular, zinc-blende GaN offers higher carrier mobilities, higher carrier drift velocities, and a higher doping efficiency than its wurtzite counterpart [105, 108, 144, 145, 147, 151]. The greater symmetry inherent to the zinc-blende crystal structure leads to the absence of spontaneous polarization induced-electric fields, thereby making devices fabricated from this material less prone to failure [153, 382, 383]. The fact that zinc-blende GaN cleaves easier than its wurtzite counterpart further adds to its allure, suggesting easier device processing and hinting at opportunities for integration with Si and GaAs-based technologies [151, 153, 384]. Prodded on by some pioneering work aimed at depositing this particular form of GaN [385,386,387,388,389,390], zinc-blende GaN’s device potential has recently attracted some attention [391, 392].
Thermodynamic arguments have demonstrated that wurtzite is InN’s stable phase. As a consequence, most research aimed at characterizing the material properties of InN has been concentrated on the wurtzite phase of this material. It should be noted, however, that some research into the zinc-blende phase of this material has also been performed. Initial reports into zinc-blende InN include those of Chandrasekhar et al. [148], Jenkins et al. [149], Strite et al. [265], Tabata et al. [152], and Yamamoto et al. [150]. In spite of this foundation, the material properties associated with zinc-blende InN still remain poorly understood when contrasted with our current understanding of its wurtzite counterpart.
Ultimately, it is hoped that our results will advance the understanding of the nature of these semiconductors, provide researchers in the field with concepts and tools that may be drawn upon when working with III–V nitride semiconductor-based materials and devices, and equip an emerging area with a quantitative framework for the development of engineering methodologies for device design and optimization.
Quantum confinement effects, and the complications they engender, must be considered in order to properly treat the nature of such a gas. Accordingly, many two-dimensional electron gas analyzes are cast within the framework of a simultaneous solution to both Schrödinger’s and Poisson’s equations. Further details on such matters are adequately addressed in the literature [428,429,430].
In the fabrication of III–V nitride semiconductor-based devices, alloying is often employed. Unfortunately, owing to limitations on the scope and scale of this review article, we opted not to dedicate much of it to alloying. Further details on alloys of the III–V nitride semiconductor group are provided in the scientific literature [434, 435].
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Acknowledgements
The authors would like to acknowledge the guidance and support of their collaborator and friend, Dr. Michael S. Shur, of Rensselaer Polytechnic Institute, whose contributions have played an important role in shaping many of the results presented herein. Financial support from the Natural Sciences and Engineering Research Council of Canada is also gratefully acknowledged.
Funding
The funding was provided by Natural Sciences and Engineering Research Council of Cananda (Grant No. 102605).
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Appendices
Appendix: Further details related to our Monte Carlo algorithm
We now provide further details of the semi-classical Monte Carlo algorithm employed for the purposes of our simulations of the electron transport within the III–V nitride semiconductors, GaN and InN. Initially, we overview a more detailed flow chart corresponding to our approach. Then, details of some of the trickier parts of our Monte Carlo algorithm will be discussed. The generation of the free-flight time will then be covered and then the selection of the scattering event (after a free-flight) will be described.
1.1 Flow chart for our Monte Carlo algorithm
A more detailed flow chart for our Monte Carlo algorithm is shown in Fig. 49. This flow chart provides a detailed description of how the dynamics of the electrons are handled, as well as how the statistics are kept during the simulation.
When the simulation initializes, it reads the input file and sets the simulation parameters. Next, the initial electron distribution is determined. During this stage, each electron in the simulation is given an initial wave-vector in accordance with a Maxwell-Boltzmann distribution. At the same time, a rejection technique is used in order to ensure that the number of electrons in any given region of \(\vec {k}\)-space never exceeds the Fermi-Dirac limit. This technique provides a close approximation to an initial Fermi-Dirac distribution.
Next, the electric field is set and the scattering rate tables are initialized. The time-step is set to zero and then a loop is entered which moves each particle through free-flights and scattering events until the end of the time-step is reached. After all of the particles are moved, macroscopic quantities, such as the electron drift velocity, are calculated over the distribution and stored in temporary arrays. At the end of the simulation, the accumulated statistics are output to a file. In the next sections, details of some of these steps are provided.
1.2 Generation of the free-flight times
The electron energy and its wave-vector, \(\vec {k}\), determine the probability that this electron will scatter by means of any of the aforementioned scattering processes. In between each scattering event, the electron’s motion is determined through semi-classical physics, i.e., Eqs. (4) and (5). The amount of time between each scattering event is determined statistically, based on the total scattering rate,
which is just the sum of the individual scattering rates corresponding to each scattering mechanism. The statistically determined time between scattering events is known as the free-flight time, \(t_{f}\).
Generating a proper distribution of free-flight times is essential in order to obtain correct simulation results. A number of methods, used for the purposes of generating these free-flight times, have already been studied in detail [167]. A derivation of the algorithm used in our simulations of the electron transport within the III–V nitride semiconductors, GaN and InN, will be provided here.
We first note that the probability distribution, \(P\left( t\right)\), for the free-flight time, of length t, is just the probability that an electron survives without a collision to time t multiplied by the probability of a collision within a small interval, dt, around t. The probability of a collision within dt of t is simply the product of the scattering rate at time t and dt. The first part of the distribution, the probability that the electron survives to time t without a collision, can be found by assuming that the scattering processes are Poisson in nature. For a Poisson process, the probability of no scattering event for any interval, \(\delta t = t_2 - t_1\), is \(P\left( N = 0\right) = \exp \left( -\lambda \delta t\right)\). If the scattering rate is constant, this would be the distribution we require. However, the scattering rate changes with time as the electron drifts under the action of the applied electric field. To take into account the fact that the scattering rates change with time, we divide the interval, \(\left[ 0, t\right]\), into i small intervals. The probability, \(p_i\), that no scattering event occurs, in interval i, is
where \(\lambda _i\) is the scattering rate during interval i and \(\delta t\) is the duration of interval i. The probability that no scattering event occurs in any of the i intervals, 0 through N, is the product of the probabilities for each interval, i.e.,
Letting the intervals become very small, i.e., \(\delta t \rightarrow dt\), the sum of Eq. (11) reduces to an integral, i.e.,
The free-flight time distribution then becomes the scattering rate multipled by \(p\left( t\right)\), i.e.,
In order to generate random free-flight times, with a given \(P\left( t\right)\), we apply a direct method [76]. In particular, we select a random number, r, with a uniform distribution between [0, 1], and set it equal to the integrated probability distribution function, i.e.,
Substituting Eq. (13) into Eq. (14), and solving the integral, yields
Thus, we conclude that
A time, t, must be found which satisfies the above equation for the random number, r.
One difficulty in evaluating the integral over \(\lambda\) is that it is a complicated function of t. This problem can be overcome by introducing an artificial scattering mechanism, known as the self-scattering mechanism, \(\lambda _0\left( \vec {k}\right)\). This new mechanism makes the total scattering rate constant over some interval of time, i.e.,
Yorston [167] discusses several algorithms for generating the free-flight times using this self-scattering concept. One of the the most efficient algorithms, and the one employed in our Monte Carlo simulations of the electron transport within the III–V nitride semiconductors, GaN and InN, is the constant-time method. In this method, a fixed time, \(t_{\text{inc}}\), is chosen, and the integral in Eq. (16) is carried out over intervals of length \(t_{\text{inc}}\). In each interval, a self-scattering mechanism, \(\lambda _0\left( \vec {k}\right)\), is added in order to make the total scattering rate constant and greater than \(\lambda \left( \vec {k}\right)\) during the \(t_{\text{inc}}\) interval. Fig. 50 illustrates this algorithm. The free-flight time is chosen when the total integral satisfies Eq. (16). At that time, \(\lambda _0\left( \vec {k}\right)\) and each \(\lambda _i\left( \vec {k}\right)\) are used to determine the choice of scattering event.
In the case a self-scattering mechanism is chosen, special treatment is necessary. The integral for the next free-flight time must continue where the previous one left off. In the example shown in Fig. 50, the integral from t to \(4 t_{\text{inc}}\) is first used, then that from \(4 t_{\text{inc}}\) to \(5 t_{\text{inc}}\) is used, and so on.
1.3 Choice of scattering event
Once the electron finishes its free-flight, it scatters. The choice of the scattering event is also made with a random number. This time, the probability that a particular scattering event is selected is directly proportional to the scattering rates corresponding to that particular mechanism. A random number, r, uniformly distributed between [0, 1], is chosen, and the scattering mechanism, i, which satisfies
where
is selected, where
Once the scattering mechanism is selected, the final wave-vector of the electron must be chosen. This selection must, of course, obey conservation of energy. With this requirement, there exists a sphere in \(\vec {k}\)-space into which the electron is allowed to scatter. Therefore, by determining the angle (azimuthal and polar) from the electron’s original direction, we may uniquely select the final wave-vector for the electron, and at the same time select the phonon with which the electron is scattering, in order to obey conservation of momentum considerations. For all the scattering mechanisms selected in our Monte Carlo approach, the selection of the azimuthal angle is done with a uniform distribution, i.e., there is no preference in terms of the azimuthal angle. However, many of the scattering mechanisms have a preference with the polar angle. For each of the scattering mechanisms in the Monte Carlo approach, the dependence of the scattering rate with the polar angle is known, i.e.,
There are three different techniques available for converting random numbers with a uniform distribution into one with an arbitrary distribution. These are the direct, rejection, and combined techniques, which are all described by Jacoboni and Lugli [76]. For most of the scattering mechanisms used in our Monte Carlo approach, the rejection technique is used to determine the polar angles. However, some of the most important mechanisms are handled differently. For polar optical phonon and piezoelectric scattering, a combined technique is used. For ionized impurity scattering at low energies, when non-parabolicity can be ignored, the direct technique is used. In other cases, the rejection technique is used, except when the distribution is highly peaked, in which case a combined technique is used.
The simulation continues, moving the electron through each time-step until a special time-step is reached, known as the collection time. After this special time-step, the macroscopic averages, which are stored in temporary arrays, are averaged and stored in permanent arrays. Each average is simply the average over all of the electrons in the simulation. For example, for the electron drift velocity,
where N denotes the total number of electrons. After each collection time, the scattering rates tables are also recalculated. This occurs because some of the scattering rates, i.e., polar optical phonon, ionized impurity, and piezoelectric, are a function of the electron temperature, which changes throughout the simulation. If the simulation requires that the applied electric field strength to be updated, then it is updated after every fourth collection time (this number can be adjusted). The average from that fourth collection time is assumed to be in steady-state and is associated with the electric field during that interval. At the end of the simulation, the quantities stored in the permanent arrays are written to an output file.
1.4 Monte Carlo codes available on the internet
A variety of Monte Carlo codes, for the purposes of simulating the steady-state and transient electron transport within bulk semiconductors, are available on the internet. For example, SDemon is available at: https://www.nanohub.org/simulation_tools/sdemon_tool_information
For a description of the theoretical basis of SDemon and its implementation, please consult, M. A. Stettler, “Monte Carlo Studies of Electron Transport in Silicon Bipolar Transistors,” MSEE Thesis, Purdue University, West Lafayette, Indianna, December 1990 and the SDemon User’s Manual. The program is written in Fortran 77. The program author was M. A. Stettler of Purdue University.
Note to Reader
Many of the results presented herein, and portions of the text, are borrowed from our previous review articles, i.e., “Steady-state and transient electron transport within the III–V nitride semiconductors, GaN, AlN, and InN: a review,” which was published in the Journal of Materials Science: Materials in Electronics in 2006 [129], “Steady-state and transient electron transport within the wide energy gap compound semiconductors gallium nitride and zinc oxide: an updated and critical review,” which was published in the Journal of Materials Science: Materials in Electronics in 2014 [142], and “A 2015 perspective on the nature of the steady-state and transient electron transport within the wurtzite phases of gallium nitride, indium nitride, and zinc oxide: a critical and retrospective review,” which was published in the Journal of Materials Science: Materials in Electronics in 2015 [143]. Copyright permission was obtained from Springer. Some results and portions of the text were also borrowed from three other articles of ours previously published in the Journal of Applied Physics, namely, “Transient electron transport in wurtzite GaN, InN, and AlN” [120], “The steady-state and transient electron transport within bulk zinc-blende indium nitride: the impact of crystal temperature and doping concentration variations” [155], and “The sensitivity of the electron transport within bulk zinc-blende gallium nitride to variations in the crystal temperature, the doping concentration, and the non-parabolicity coefficient associated with the lowest energy conduction band valley” [156]. Copyright permission was obtained from the American Institute of Physics.
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Siddiqua, P., O’Leary, S.K. Electron transport within the wurtzite and zinc-blende phases of gallium nitride and indium nitride. J Mater Sci: Mater Electron 29, 3511–3567 (2018). https://doi.org/10.1007/s10854-017-8324-1
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DOI: https://doi.org/10.1007/s10854-017-8324-1