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Effect of metallization time on thermal stability of copper-plated polylactide

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Abstract

The influence of metallization time on thermal stability of copper-plated polylactide (PLA) has been presented. The tests of oxidation onset temperature (OOT) and thermogravimetric analysis (TG) of metallized samples have been performed. Studies have shown that in the case of OOT, effect of metallization time is most pronounced for samples with a highly modified surface. This is due to an increase in contact area between the PLA and copper layer, leading to an increase in the catalytic activity of copper atoms relative to the oxidation process. In TG studies, the greatest effect of metallization time was observed for samples with the least modified surface. Observed effect is related to the variation in thickness of the deposited copper. Low heat capacity and a good thermal conductivity of copper lead to faster heating of the deposited layer, improve the heat transfer to the polymer bulk and thus faster increase in its temperature resulting in lowering of thermal stability.

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Acknowledgements

The project has been financed from the funds of the National Science Centre allocated upon Decision Number DEC-2011/01/N/ST8/04397.

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  1. Kazimierz Wielki University, Chodkiewicza 30, 85-064, Bydgoszcz, Poland

    Krzysztof Moraczewski

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  1. Krzysztof Moraczewski
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Correspondence to Krzysztof Moraczewski.

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Moraczewski, K. Effect of metallization time on thermal stability of copper-plated polylactide. J Therm Anal Calorim 129, 1697–1703 (2017). https://doi.org/10.1007/s10973-017-6382-5

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  • DOI: https://doi.org/10.1007/s10973-017-6382-5

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