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Molecular dynamics simulations of thermal effects in nanometric cutting process

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Abstract

Understanding the basic action of how material removing in nanoscale is a critical issue of producing well-formed components. In order to clarify thermal effects on material removal at atomic level, molecular dynamics (MD) simulations of nanometric cutting of mono-crystalline copper are performed with Morse, EAM and Tersoff potential. The effects of cutting speed on temperature distribution are investigated. The simulation results demonstrate that the temperature distribution shows a roughly concentric shape around shear zone and a steep temperature gradient lies in diamond tool, a relative high temperature is located in shear zone and machined surface, but the highest temperature is found in chip. At a high cutting speed mode, the atoms in shear zone with high temperature implies a large stress is built up in a local region.

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Authors and Affiliations

  1. Precision Research Engineering Institute, Harbin Institute of Technology, Harbin, 150001, China

    YongBo Guo, YingChun Liang, MingJun Chen, QingShun Bai & LiHua Lu

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  1. YongBo Guo
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  2. YingChun Liang
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  3. MingJun Chen
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  5. LiHua Lu
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Correspondence to YongBo Guo.

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Guo, Y., Liang, Y., Chen, M. et al. Molecular dynamics simulations of thermal effects in nanometric cutting process. Sci. China Technol. Sci. 53, 870–874 (2010). https://doi.org/10.1007/s11431-009-0243-9

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  • DOI: https://doi.org/10.1007/s11431-009-0243-9

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