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Analysis of heat transfer of loop heat pipe used to cool high power LED

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Abstract

A novel loop heat pipe (LHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of the loop heat pipe under different heat loads and incline angles have been investigated experimentally. The obtained results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19–3.1 K/W, the temperature uniformity in the evaporator is controlled within 1.5°C, and the junction temperature of high power LED can be controlled steadily under 100°C for a heat load of 100 W.

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References

  1. Arik M, Weaver S. Chip scale thermal management of high brightness LED packages. In: 4th Int Conf Solid State Lighting, Denver, Colorado, USA, 2004. 214–223

  2. Hong E, Narendran N. A method for projecting useful life of LED lighting systems. In: 3rd Int Conf Solid State Lighting, San Diego, California, USA, 2003. 93–99

  3. Yang L, Jang S, Hwang W, et al. Thermal analysis of high power GaN-based LEDs with ceramic package. Thermochim Acta, 2007, 455(1–2): 95–99

    Article  Google Scholar 

  4. Luo X B, Liu S, Jiang X P, et al. Experimental and numerical study on a micro jet cooling solution for high power LEDs. Sci China Ser E-Tech Sci, 2007, 50(4): 478–489

    Article  Google Scholar 

  5. Sheu G J, Hwu F S, Tu S H, et al. The heat dissipation performance of LED applied a MHP. In: 5th Int Conf Solid State Lighting, San Diego, California, USA, 2005. 13–20

  6. Shin M W. Thermal design of high-power LED package and system. In: Adv LEDs Solid State Lighting, Kwangju, South Korea, 2006. 9–21

  7. Kim L, Choi J H, Jang S H, et al. Thermal analysis of LED array system with heat pipe. Thermochim Acta, 2007, 455(1–2): 21–25

    Article  Google Scholar 

  8. Lu X Y, Cheng Y X, Liu M J, et al. Experimental investigation on heat pipe heat sink for cooling high power LED (in Chinese). Semicond Optoelectr, 2008, 29(5): 56–58

    Google Scholar 

  9. Liu M J, Lu X Y, Hua Z Z. The testing of a loop heat pipe cooling device for high power illumination LED (in Chinese). J Refrig, 2008, 29(5): 39–43

    MATH  Google Scholar 

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Authors and Affiliations

  1. School of Power Engineering, Shanghai University of Science and Technology, Shanghai, 200093, China

    XiangYou Lu, ZeZhao Hua, MeiJing Liu & YuanXia Cheng

Authors
  1. XiangYou Lu
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  2. ZeZhao Hua
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  3. MeiJing Liu
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  4. YuanXia Cheng
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Corresponding author

Correspondence to XiangYou Lu.

Additional information

Supported by the National Natural Science Foundation of China (Grant No. 50676063) and the Shanghai Leading Academic Discipline Project (Grant No. S30503

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Lu, X., Hua, Z., Liu, M. et al. Analysis of heat transfer of loop heat pipe used to cool high power LED. Sci. China Ser. E-Technol. Sci. 52, 3527–3532 (2009). https://doi.org/10.1007/s11431-009-0286-y

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  • DOI: https://doi.org/10.1007/s11431-009-0286-y

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