Abstract
β-Ga2O3 MOSFETs are demonstrated on heterogeneous Ga2O3-Al2O3-Si (GaOISi) substrate fabricated by ion-cutting process. Enhancement (E)- and depletion (D)-mode β-Ga2O3 transistors are realized on by varying the channel thickness (Tch). E-mode GaOISi transistor with a Tch of 15 nm achieves a high threshold voltage VTH of ∼8 V. With the same T increase, GaOISi transistors demonstrate more stable ON-current ION and OFF-current IOFF performance compared to the reported devices on bulk Ga2O3 wafer. Transistors on GaOISi achieve the breakdown voltage of 522 and 391 V at 25°C and 200°C, respectively.
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This work was supported by the National Key Research and Development Project (Grant No. 2018YFB2200500), the National Natural Science Foundation of China (Grant Nos. 61851406, 61874128, 11622545 61534004, 61604112, and 61622405), the Frontier Science Key Program of Chinese Academy of Sciences (Grant No. QYZDY-SSW-JSC032), and the Shanghai Municipal Science and Technology Commission (Grant No. 18511110503).
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Wang, Y., Xu, W., You, T. et al. β-Ga2O3 MOSFETs on the Si substrate fabricated by the ion-cutting process. Sci. China Phys. Mech. Astron. 63, 277311 (2020). https://doi.org/10.1007/s11433-020-1533-0
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DOI: https://doi.org/10.1007/s11433-020-1533-0