Skip to main content
SpringerLink
Log in

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

  • Published:
Metallurgical and Materials Transactions A Aims and scope Submit manuscript

Abstract

This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal aging conditions. The tensile strength of Sn-3.5Ag/Ni-P solder joints decreases with aging temperature and duration. Four types of failure modes have been identified. The failure modes shift from the bulk solder failure mode in the as-soldered condition toward the interfacial failure modes. Kirkendall voids do not appear to affect the tensile strength of the joint. The volume change of Ni-P phase transformation during the thermal aging process generates high tensile stress inside the Ni-P layer; this stress causes mudflat cracks on the remaining Ni-P coating and also leads to its delamination from the underlying Ni substrate. In general, interfacial reaction and the subsequent growth of Ni3Sn4 intermetallic compound (IMC) layer during solid-state reaction are the main reasons for the decrease of tensile strength of the solder joints. The current study finds there is an empirical linear relation between the solder joint strength and the Ni3Sn4 intermetallic compound (IMC) thickness. Therefore, the IMC thickness may be used as an indication of the joint strength.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. K.N. Tu and K. Zeng: Mater. Sci. Eng. R, 2001, vol. 34, pp. 1–58.

    Article  Google Scholar 

  2. S. Ahat, M. Sheng, and L. Luo: J. Mater. Res., 2001, vol. 16, pp. 2914–21.

    CAS  Google Scholar 

  3. M. He, Z. Chen, and G.J. Qi: Acta Mater., 2004, vol. 52, pp. 2047–56.

    Article  CAS  Google Scholar 

  4. K. Kishimoto, M. Omiya, and M. Amagai: Proc. 3rd Int. Symp. on Electronic Materials and Packaging, Cheju, Korea, IEEE, New York, NY, 2002, pp. 8–14.

    Google Scholar 

  5. H.T. Lee and M.H. Chen: Mater. Sci. Eng. A, 2002, vol. 333, pp. 24–34.

    Article  Google Scholar 

  6. T.Y. Lee, W.J. Choi, K.N. Tu, and J.W. Jang: J. Mater. Res., 2002, vol. 17, pp. 291–301.

    CAS  Google Scholar 

  7. G.J. Qi, M. He, and Z. Chen: Proc. Yazawa Int. Symp., in Conjunction with the 2003 TMS Annual Meeting and Exhibition, San Diego, CA, TMS, Warrendale, PA, 2003, vol. 1, pp. 1173–83.

    Google Scholar 

  8. M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya: Microelectron. Reliab., 2002, vol. 42, pp. 951–66.

    Article  Google Scholar 

  9. D.R. Frear and P.T. Vianco: Metall. Mater. Trans. A, 1994, vol. 25A, pp. 1509–23.

    CAS  Google Scholar 

  10. R.E. Pratt, E.I. Stromswold, and D.J. Quesnel: J. Electron. Mater., 1994, vol. 23, pp. 375–81.

    CAS  Google Scholar 

  11. R.E. Pratt, E.I. Stromswold, and D.J. Quesnel: IEEE Trans. Compon. Packaging, Part A, 1996, vol. 19, pp. 134–41.

    Article  CAS  Google Scholar 

  12. D.R. Frear, F.M. Hosking, and P.T. Vianco: in Materials Developments in Microelectronic Packaging, P.J. Singh, ed., ASM INTERNATIONAL, Materials Park, OH, 1991, pp. 229–40.

    Google Scholar 

  13. S.W. Chen, S.W. Lee, and M.C. Yip: J. Electron. Mater., 2003, vol. 32, pp. 1284–89.

    Article  CAS  Google Scholar 

  14. C.W. Hwang, K. Suganuma, M. Kiso, and S. Hashimoto: J. Mater. Res., 2003, vol. 18, pp. 2540–43.

    CAS  Google Scholar 

  15. S.J. Wang and C.Y. Liu: Scripta Mater., 2003, vol. 49, pp. 813–18.

    Article  CAS  Google Scholar 

  16. K. Zeng and K.N. Tu: Mater. Sci. Eng. R, 2002, vol. 38, pp. 55–105.

    Article  Google Scholar 

  17. Y.C. Chan, P.L. Tu, C.W. Tang, K.C. Hung, and J.K.L. Lai: IEEE Trans. Adv. Packaging, 2001, vol. 24, pp. 25–32.

    Article  CAS  Google Scholar 

  18. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson: J. Appl. Phys., 1999, vol. 85, pp. 8456–63.

    Article  CAS  Google Scholar 

  19. S. Ahat, W. Huang, M. Sheng, and L. Luo: J. Electron. Mater., 2002, vol. 31, pp. 136–41.

    CAS  Google Scholar 

  20. K.C. Hung, Y.C. Chan, C.W. Tangand, and H.C. Ong: J. Mater. Res., 2000, vol. 15, pp. 2534–39.

    CAS  Google Scholar 

  21. Y. Chonan, T. Komiyama, J. Onuki, R. Urao, T. Kimura, and T. Nagano: Mater. Trans., 2002, vol. 43, pp. 1840–46.

    Article  CAS  Google Scholar 

  22. Y. Chonan, T. Komiyama, J. Onuki, R. Urao, T. Kimura, and T. Nagano: Mater. Trans., 2002, vol. 43, pp. 1887–90.

    Article  CAS  Google Scholar 

  23. J.K. Lin, A.D. Silva, D. Frear, Y. Guo, and J.W. Jang: Proc. 51st Electronic Components and Technology Conf., Orlando, FL, IEEE, New York, NY, 2001, pp. 455–62.

    Google Scholar 

  24. P.T. Vianco: Soldering Handbook, 3rd ed., American Welding Society, Miami, FL, 1999, pp. 214–17.

    Google Scholar 

  25. Y.W. Cheng and T.A. Siewert: J. Electron. Mater., 2003, vol. 32, pp. 535–40.

    Article  CAS  Google Scholar 

  26. D.P. Yao and J.K. Shang: IEEE Trans. Compon. Packaging, Part B, 1996, vol. 19, pp. 154–65.

    Article  CAS  Google Scholar 

  27. Y.D. Jeon, K.W. Paik, K.S. Bok, W.S. Choi, and C.L. Cho: J. Electron. Mater., 2002, vol. 31, pp. 520–28.

    Article  CAS  Google Scholar 

  28. G.O. Mallory and J.B. Hajdu: Electroless Plating: Fundamentals and Applications, Reprint ed., AESF, Noyes/William Andrew Publishing, Norwich, NY, 1990, pp. 122–25.

    Google Scholar 

  29. S. Anhock, A. Ostmann, H. Oppermann, R. Aschenbrenner, and H. Reichl: Symp. on Advanced Packaging Materials, Braselton, GA, IEEE, New York, NY, pp. 256–61.

  30. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K.M. Chong, and O. Villalobos: Proc. 52nd Electronic Components and Technology Conf., San Diego, CA, 2002, pp. 732–39.

Download references

Author information

Authors and Affiliations

  1. the School of Materials Engineering, Nanyang Technological University, 639 798, Singapore

    Min He (Mars Candidate) & Zhong Chen (Associate Professor)

  2. the Singapore Institute of Manufacturing Technology, 638 075, Singapore

    Guojun Qi (Senior Scientist)

Authors
  1. Min He
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Zhong Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Guojun Qi
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

He, M., Chen, Z. & Qi, G. Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints. Metall Mater Trans A 36, 65–75 (2005). https://doi.org/10.1007/s11661-005-0139-7

Download citation

  • Received:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11661-005-0139-7

Keywords

Search

Navigation