Abstract
Sn-Zn alloys have been considered for use as lead-free solders. Their poor wetting and oxidation resistance properties are the main obstacles that prevent them from becoming commercially viable solders. The effects of alloying elements, such as lanthanum, titanium, aluminum, and chromium, on oxidation resistance, wetting properties, and tensile properties of eutectic Sn-Zn solder are described herein. Results show the addition of alloying Ti, Al, and Cr can improve the oxidation resistance of Sn-9Zn solder. La, Ti, and Cr do not have much effect on the wetting properties, whereas Al worsens the wetting. Differential scanning calorimetry investigations reveal the solidus temperature of these solders to be ∼200°C. Addition of Cr improves ductility while maintaining tensile strength.
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References
S.K. Kang, J. Electron. Mater. 8, 701 (1994).
M. Miyaki, M. Kanai, and S. Ogata, Proc. 3rd 1999 IEMT/IMC Symp. (Tokyo: JIEP, 1999), pp. 125–130.
J.H. Vincent and G. Humpston, GEC J. Res. 11, 76 (1994).
J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology (New York: Electrochemical Publications, 2001).
A. Forsten, H. Steen, I. Wilding, and J. Friedrich, Solder Surf. Mount Technol. 12, 29 (2000).
H. Mavoori et al., J. Electron. Mater. 26, 783 (1997).
M. McCormack, S. Jin, and G.W. Kammlott, 1995 Proc. IEEE Int. Symp. (Piscataway, NJ: IEEE, 1995), pp. 171–176.
K. Suganuma, Curr. Opin. Solid State Mater. 5, 55 (2001).
M. Abtew and G. Selvaduray, Mater. Sci. Eng., R 27, 95 (2000).
E.P. Wood and K.L. Nimmo, J. Electron. Mater. 23, 709 (1994).
M. McCormack and S. Jin, J. Electron. Mater. 23, 715 (1994).
F. Hua and J. Glaze, Design and Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara, S.M.L. Sastry, and P.K. Liaw (Warrendale, PA: TMS, 1997), pp. 65–73.
S. Vaynman and M.E. Fine, Scripta Mater. 41, 1269 (1999).
M. McCormack, S. Jin, H.S. Chen, and D.A. Machusak, J. Electron. Mater. 7, 687 (1994).
M. Tadauchi, I. Komatsu, H. Tateishi, and K. Teshima, Proc. 2nd Int. Symp. on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign ’01 (Piscataway, NJ: IEEE, 2001), pp. 1055–1058.
H.Z. Huang, X.Q. Wei, and L. Zhou, Electron. Compon. Mater. (Chinese) 4, 39 (2003).
K.L. Lin and T.P. Liu, Oxid. Met. 50, 255 (1998).
K.L. Lin, K.J. Chen, H.M. Hsu, and L. Shi, Proc. 53rd Electronic Components and Technology Conf., New Orleans, Louisiana, 2003 (Piscataway, NJ: IEEE, 2003), pp. 658–663.
GB11364-89, The Standard Test Method on Wettability Estimation of Solders (The National Standard of China, 1989).
GB/T228-2002, Metallic Materials-Tensile Testing at Ambient Temperature (The National Standard of China, 2002).
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Chen, X., Li, M., Ren, X.X. et al. Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy. J. Electron. Mater. 35, 1734–1739 (2006). https://doi.org/10.1007/s11664-006-0227-5
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DOI: https://doi.org/10.1007/s11664-006-0227-5